Tool List: Difference between revisions
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*[[E-Beam 3 (Temescal)]] |
*[[E-Beam 3 (Temescal)]] |
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*[[E-Beam 4 (CHA)]] |
*[[E-Beam 4 (CHA)]] |
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*[[Sputter 1 (Custom)]] |
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*[[Sputter 2 (SFI Endeavor)]] |
*[[Sputter 2 (SFI Endeavor)]] |
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*[[Sputter 3 (AJA ATC 2000-F)]] |
*[[Sputter 3 (AJA ATC 2000-F)]] |
Revision as of 00:59, 9 July 2015
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)