Tool List: Difference between revisions

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*[[E-Beam 3 (Temescal)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[E-Beam 4 (CHA)]]
*[[Sputter 1 (Custom)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 2 (SFI Endeavor)]]
*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 3 (AJA ATC 2000-F)]]

Revision as of 00:59, 9 July 2015

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization