Tool List: Difference between revisions
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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*[[ |
*[[Vapor HF Etch]] |
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Revision as of 23:24, 31 January 2014
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)