Tool List

Lithography

You can see our available photoresists on the Chemical Datasheets page.

Contact Aligners (Optical Exposure) Suss Aligners (SUSS MJB-3) IR Aligner (SUSS MJB-3 IR) Contact Aligner (SUSS MA-6) DUV Flood Expose Other Patterning Systems E-Beam Lithography System (JEOL JBX-6300FS) Nano-Imprint (Nanonex NX2000) Holographic Litho/PL Setup (Custom)

Steppers (Optical Exposure) Stepper 1 (GCA 6300, i-line) Stepper 2 (AutoStep 200, i-line) Stepper 3 (ASML DUV, Deep-UV) Thermal Processing for Photolithography Ovens 1, 2 & 3 (Labline) Oven 4 (Fisher) Oven 5 (Labline) High Temp Oven (Blue M) Vacuum Oven (YES) The Spinner Benches have pre-set hotplates at various temperatures appropriate for common photoresist bakes.

Vacuum Deposition

Physical Vapor Deposition (PVD) E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Thermal Evap 1 Thermal Evap 2 (Solder) Sputter Deposition Sputter 3 (AJA ATC 2000-F) Sputter 4 (AJA ATC 2200-V) Sputter 5 (AJA ATC 2200-V) Ion Beam Deposition (Veeco NEXUS)

Chemical Vapor Deposition (CVD) PECVD 1 (PlasmaTherm 790) PECVD 2 (Advanced Vacuum) ICP-PECVD (Unaxis VLR) Molecular Vapor Deposition Atomic Layer Deposition (Oxford FlexAL)

Dry Etch

RIE 2 (MRC) RIE 3 (MRC) RIE 5 (PlasmaTherm) Si Deep RIE (PlasmaTherm/Bosch Etch) DSEIII (PlasmaTherm/Deep Silicon Etcher) Ashers (Technics PEII) UV Ozone Reactor CAIBE (Oxford Ion Mill)

ICP Etch 1 (Panasonic E626I) ICP Etch 2 (Panasonic E640) ICP-Etch (Unaxis VLR) Plasma Clean (Gasonics 2000) XeF2 Etch (Xetch) Plasma Activation (EVG 810) Vapor HF Etch

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Wet Benches Solvent Cleaning Benches Spin Coat Benches Develop Benches Toxic Corrosive Benches HF/TMAH Processing Benches Plating Bench

Gold Plating Bench Critical Point Dryer Spin Rinse Dryer (SemiTool) Chemical-Mechanical Polisher (Logitech)

Thermal Processing

• Rapid Thermal Processor (AET RX6)
• Strip Annealer
• Tube Furnace (Tystar 8300)
• Tube Furnace Wafer Bonding (Thermco)
• Tube Furnace AlGaAs Oxidation (Linberg)
• Wafer Bonder (SUSS SB6-8E)
• Ovens 1, 2 & 3 (Labline)
• Oven 4 (Fisher)
• Oven 5 (Labline)
• High Temp Oven (Blue M)
• Vacuum Oven (YES)

Packaging

• Dicing Saw (ADT)
• Flip-Chip Bonder (Finetech)
• Vacuum Sealer
• Wire Saw (Takatori)

Inspection, Test and Characterization

Optical/Electron Microscopy Field Emission SEM 1 (FEI Sirion) Field Emission SEM 2 (JEOL 7600F) SEM Sample Coater (Hummer) Optical Microscopes Fluorescence Microscope (Olympus MX51) Deep UV Optical Microscope (Olympus) Laser Scanning Confocal M-scope (Olympus LEXT) Photo-emission & IR Microscope (QFI) Topographical Metrology Step Profile (Dektak IIA) Step Profilometer (Dektak 6M) Atomic Force Microsope (Dimension 3100/Nanoscope IVA) Surface Analysis (KLA/Tencor Surfscan) Sub-micron Particle Counter Laser Scanning Confocal M-scope (Olympus LEXT)

Thin-Film Analysis/Measurement Ellipsometer (Woollam) Ellipsometer (Rudolph) Film Stress (Tencor Flexus) Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV) Optical Film Thickness (Filmetrics F20) Optical Film Thickness (Nanometric) Resistivity Mapper (CDE RESMAP) Other Tools Probe Station & Curve Tracer Goniometer