Difference between revisions of "Tool List"

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*[[Flip-Chip Bonder (Finetech)]]
*[[Flip-Chip Bonder (Finetech)]]
*[[Vacuum Sealer]]
*[[Vacuum Sealer]]
*[[Wire Saw (Takatori)]]
=Inspection, Test and Characterization=
=Inspection, Test and Characterization=

Revision as of 10:15, 28 October 2021


Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing


Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Other Properties
Electrical Analysis
Other Tools