Tool List: Difference between revisions
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=Packaging= |
=Packaging= |
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* [[Flip-Chip Bonder (Finetech)]] |
* [[Flip-Chip Bonder (Finetech)]] |
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* [[Vacuum Sealer]] |
* [[Vacuum Sealer]] |
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⚫ | |||
⚫ | |||
* [[Wafer Bonder (SUSS SB6-8E)]] |
* [[Wafer Bonder (SUSS SB6-8E)]] |
||
⚫ | |||
=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
Revision as of 17:55, 11 July 2012
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
Packaging
- Dicing Saw (ADT)
- Flip-Chip Bonder (Finetech)
- Vacuum Sealer
- Wafer Bonder (SUSS SB6-8E)
- Wire Saw (Takatori)