Tool List

Lithography

Photoresists and Lithography Chemicals See the Chemical Datasheets page. Auto. Coat/Develop (S-Cubed Flexi) Contact Aligners (Optical Exposure) Suss Aligners (SUSS MJB-3) Contact Aligner (SUSS MA-6) DUV Flood Expose Direct-Write Lithography E-Beam Lithography System (JEOL JBX-6300FS) E-Beam Lithography (FEI Sirion Nabity v9) Focused Ion-Beam Lithography (Raith Velion) Maskless Aligner (Heidelberg MLA150) Other Patterning Systems Holographic Litho/PL Setup (Custom)

Steppers (Optical Exposure) Stepper 1 (GCA 6300, i-line) Stepper 2 (AutoStep 200, i-line) Stepper 3 (ASML DUV, Deep-UV) Thermal Processing for Photolithography Ovens - Overview of all lab ovens Ovens 1, 2 & 3 (Labline) Oven 4 (Fisher) Oven 5 (Labline) High Temp Oven (Blue M) Vacuum Oven (YES) Lithography Support The Spinner Benches have pre-set hotplates at various temperatures appropriate for common photoresist bakes. POLOS spinners on Develop and Solvent benches Spin/Rinse/Dryer

Vacuum Deposition

Physical Vapor Deposition (PVD) E-Beam 1 (Sharon) E-Beam 2 (Custom) E-Beam 3 (Temescal) E-Beam 4 (CHA) Thermal Evap 1 Thermal Evap 2 (Solder) Sputter Deposition Sputter 3 (AJA ATC 2000-F) Sputter 4 (AJA ATC 2200-V) Sputter 5 (AJA ATC 2200-V) Ion Beam Deposition (Veeco NEXUS)

Chemical Vapor Deposition (CVD) PECVD 1 (PlasmaTherm 790) PECVD 2 (Advanced Vacuum) ICP-PECVD (Unaxis VLR) Molecular Vapor Deposition Atomic Layer Deposition (Oxford FlexAL)

Dry Etch

Reactive Ion Etching (RIE) RIE 2 (MRC) RIE 3 (MRC) RIE 5 (PlasmaTherm) Plasma Etching and Cleaning Plasma Clean (Gasonics 2000) Plasma Clean (YES EcoClean) Plasma Activation (EVG 810) Ashers (Technics PEII) Etch Monitoring Laser Etch Monitoring (Endpoint Detection) Optical Emission Spectra Residual Gas Analyzer (RGA)

ICP-RIE ICP Etch 1 (Panasonic E626I) ICP Etch 2 (Panasonic E640) ICP-Etch (Unaxis VLR) Oxford ICP Etcher (PlasmaPro 100 Cobra) Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher) Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher) Ion Milling and Reactive Ion Beam Etching CAIBE (Oxford Ion Mill) Other Dry Etching UV Ozone Reactor XeF2 Etch (Xetch) Vapor HF Etch

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Wet Benches Solvent Cleaning Benches Spin Coat Benches Develop Benches Toxic Corrosive Benches HF/TMAH Processing Benches Plating Bench

Gold Plating Bench Critical Point Dryer Spin Rinse Dryer (SemiTool) Chemical-Mechanical Polisher (Logitech) Mechanical Polisher (Allied) Auto. Coat/Develop (S-Cubed Flexi) Auto. Wet-Processing Spinners (POLOS)

Thermal Processing

Rapid Thermal Annealer/Processor "RTA" (AET RX6) Rapid Thermal Processor (SSI Solaris 150) Tube Furnace (Tystar 8300) Tube Furnace Wafer Bonding (Thermco) Tube Furnace AlGaAs Oxidation (Lindberg) Wafer Bonder (SUSS SB6-8E) Wafer Bonder/Wax Mounting (Logitech WBS2)

Ovens - Overview of all Lab Ovens Ovens 1, 2 & 3 (Labline) Oven 4 (Thermo-Fisher HeraTherm) Oven 5 (Labline) Vacuum Oven (YES) High Temp Oven (Blue M)

Packaging

Die Singulation / Down-sizing Dicing Saw (ADT) Wafer Cleaver (PELCO LatticeAx) Other Packaging Vacuum Sealer

Wafer/Die Bonding Flip-Chip Bonder (Finetech) Wafer Bonder (SUSS SB6-8E) Wafer Bonder/Wax Mounting (Logitech WBS2)

Inspection, Test and Characterization

Optical Microscopy Optical Microscopes - General Use Fluorescence Microscope (Olympus MX51) Deep UV Optical Microscope (Olympus) Laser Scanning Confocal M-scope (Olympus LEXT) Photo-emission & Thermal IR Microscope (QFI) Digital Microscope #7 (Olympus DSX1000) Electron Microscopy Field Emission SEM 1 (FEI Sirion) Field Emission SEM 2 (JEOL 7600F) SEM Sample Coater (Hummer) Topographical Metrology Step Profilometer (KLA Tencor P-7) Step Profilometer (Dektak 6M) Atomic Force Microsope (Bruker ICON) Laser Scanning Confocal M-scope (Olympus LEXT)

Thin-Film/Material Analysis Thickness + Optical Constants Ellipsometer (Woollam) Optical Film Thickness (Filmetrics F20) Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV) Optical Film Thickness (Nanometric) Optical Film Thickness & Wafer-Mapping (Filmetrics F50) Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX) Electrical Analysis Resistivity Mapper (CDE RESMAP) Probe Station & Source/Meter Units Other Properties Film Stress (Tencor Flexus) Particle Counts (KLA/Tencor Surfscan) Photoluminescence PL Setup (Custom) Goniometer (Ramé-Hart A-100) Surface hydrophobicity