Tool List: Difference between revisions

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=Packaging=
=Packaging=
* [[Dicing Saw (ADT)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Flip-Chip Bonder (Finetech)]]
* [[Vacuum Sealer]]
* [[Vacuum Sealer]]
* [[Dicing Saw (ADT)]]
* [[Wire Saw (Takatori)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
* [[Wire Saw (Takatori)]]


=Inspection, Test and Characterization=
=Inspection, Test and Characterization=

Revision as of 17:55, 11 July 2012

Lithography

Vacuum Deposition

Dry Etch

Wet Processing

Thermal Processing

Packaging

Inspection, Test and Characterization