Tool List: Difference between revisions
Jump to navigation
Jump to search
(→Thickness + Optical Constants: Deleted Nanometrics (removed from lab)) |
(→Vacuum Deposition: Added SEM Hummer coater, adn Thermal Evap heading) |
||
Line 55: | Line 55: | ||
|- valign="top" |
|- valign="top" |
||
| width="300" | |
| width="300" | |
||
====Physical Vapor Deposition (PVD)==== |
|||
===== Thermal Evaporation ===== |
|||
*[[E-Beam 1 (Sharon)]] |
*[[E-Beam 1 (Sharon)]] |
||
Line 70: | Line 72: | ||
*[[Sputter 5 (AJA ATC 2200-V)]] |
*[[Sputter 5 (AJA ATC 2200-V)]] |
||
*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
||
* [[SEM Sample Coater (Hummer)]] |
|||
| width="400" | |
| width="400" | |
Revision as of 13:46, 22 June 2022
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and Cleaning
Etch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Inspection, Test and Characterization
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical AnalysisOther Properties |