Tool List: Difference between revisions
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=Lithography= |
=Lithography= |
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{| |
{| |
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|-valign="top" |
|- valign="top" |
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|width=300| |
| width="300" | |
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* [[Suss Aligners (SUSS MJB-3)]] |
* [[Suss Aligners (SUSS MJB-3)]] |
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* [[IR Aligner (SUSS MJB-3 IR)]] |
* [[IR Aligner (SUSS MJB-3 IR)]] |
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* [[Vacuum Oven (YES)]] |
* [[Vacuum Oven (YES)]] |
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* [[Holographic Lith/PL Setup (Custom)]] |
* [[Holographic Lith/PL Setup (Custom)]] |
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|width=400| |
| width="400" | |
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* [[Stepper 1 (GCA 6300)]] |
* [[Stepper 1 (GCA 6300)]] |
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* [[Stepper 2 (AutoStep 200)]] |
* [[Stepper 2 (AutoStep 200)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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*[[Molecular Vapor Deposition]] |
*[[Molecular Vapor Deposition]] |
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*[[Atomic Layer Deposision (Oxford FlexAL)]] |
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]] |
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=Wet Processing= |
=Wet Processing= |
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{| |
{| |
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|-valign="top" |
|- valign="top" |
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|width=300| |
| width="300" | |
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* [[Wet Benches]] |
* [[Wet Benches]] |
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**[[Solvent Cleaning Benches]] |
**[[Solvent Cleaning Benches]] |
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**[[HF/TMAH Processing Benches]] |
**[[HF/TMAH Processing Benches]] |
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**[[Plating Bench]] |
**[[Plating Bench]] |
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|width=400| |
| width="400" | |
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* [[Gold Plating Bench]] |
* [[Gold Plating Bench]] |
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* [[Critical Point Dryer]] |
* [[Critical Point Dryer]] |
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=Inspection, Test and Characterization= |
=Inspection, Test and Characterization= |
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{| |
{| |
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|-valign="top" |
|- valign="top" |
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|width=300| |
| width="300" | |
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* [[Field Emission SEM 1 (FEI Sirion)]] |
* [[Field Emission SEM 1 (FEI Sirion)]] |
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* [[Field Emission SEM 2 (JEOL 7600F)]] |
* [[Field Emission SEM 2 (JEOL 7600F)]] |
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* [[Optical Film Thickness (Nanometric)]] |
* [[Optical Film Thickness (Nanometric)]] |
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* [[Goniometer]] |
* [[Goniometer]] |
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|width=400| |
| width="400" | |
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* [[Film Stress (Tencor Flexus)]] |
* [[Film Stress (Tencor Flexus)]] |
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* [[SEM Sample Coater (Hummer)]] |
* [[SEM Sample Coater (Hummer)]] |
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Revision as of 17:58, 15 November 2017
Lithography
Vacuum Deposition
Dry Etch
Wet Processing
Thermal Processing
- Rapid Thermal Processor (AET RX6)
- Strip Annealer
- Tube Furnace (Tystar 8300)
- Tube Furnace Wafer Bonding (Thermco)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Wafer Bonder (SUSS SB6-8E)
- Ovens 1, 2 & 3 (Labline)
- Oven 4 (Fisher)
- Oven 5 (Labline)
- High Temp Oven (Blue M)
- Vacuum Oven (YES)