Tool List: Difference between revisions

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=====Contact Aligners (Optical Exposure)=====
=====Contact Aligners (Optical Exposure)=====


*[[Suss Aligners (SUSS MJB-3)]]
*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[DUV Flood Expose]]
*[[DUV Flood Expose]]
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Maskless Aligner (Heidelberg MLA150)]]
*[[Maskless Aligner (Heidelberg MLA150)]]
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*[[Oven 5 (Labline)]]
*[[Oven 5 (Labline)]]
*[[High Temp Oven (Blue M)]]
*[[High Temp Oven (Blue M)]]
*[[Vacuum Oven (YES)]]


=====Lithography Support=====
=====Lithography Support=====
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*[[E-Beam 3 (Temescal)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[E-Beam 4 (CHA)]]
*[[E-Beam 5 (Plasys)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[Thermal Evap 2 (Solder)]]
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*[[RIE 2 (MRC)]]
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[RIE 5 (PlasmaTherm)]]


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=====ICP-RIE=====
=====ICP-RIE=====


*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 1 (Panasonic E646V)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP Etch 2 (Panasonic E626I)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]


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**[[Develop Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[Toxic Corrosive Benches]]
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
**[[HF/TMAH Processing Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
**[[Plating Bench]]
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=Packaging=
=Packaging=
''Back-end Fabrication Tools''
{|
{|
|
|
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*[[Dicing Saw (ADT)]]
*[[Dicing Saw (ADT)]]
*[[Wafer Cleaver (PELCO Flip-Scribe)|Wafer Cleaver (PELCO Flipscribe)]]
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]


====Other Packaging====
====Other Packaging====
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|}
|}


=Inspection, Test and Characterization=
=Measurement & Characterization=
''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
{|
{|
|- valign="top"
|- valign="top"
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*[[Deep UV Optical Microscope (Olympus)]]
*[[Deep UV Optical Microscope (Olympus)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]


=====Electron Microscopy=====
=====Electron Microscopy=====


*[[Field Emission SEM 1 (FEI Sirion)]]
*[[SEM 1 (JEOL IT800SHL)]]
*[[Field Emission SEM 2 (JEOL 7600F)]]
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
*[[SEM Sample Coater (Hummer)]]
*[[SEM Sample Coater (Hummer)]]


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*[[Step Profilometer (KLA Tencor P-7)]]
*[[Step Profilometer (KLA Tencor P-7)]]
*[[Step Profilometer (Dektak 6M)]]
*[[Step Profilometer (DektakXT)]]
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
| width="400" |
| width="400" |

=====Thin-Film/Material Analysis=====
=====Thin-Film/Material Analysis=====


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*[[Resistivity Mapper (CDE RESMAP)]]
*[[Resistivity Mapper (CDE RESMAP)]]
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]


======Other Properties======
======Other Properties======
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*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
*[[Photoluminescence PL Setup (Custom)]]
*[[Photoluminescence PL Setup (Custom)]]
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
**''Surface hydrophobicity''
|-
|-
|}
|}

== [[Decomissioned Tools]] ==
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

Latest revision as of 22:28, 6 August 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties

Decomissioned Tools

Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.