Tool List: Difference between revisions

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m (→‎Electrical Analysis: fix QFI link)
(Made a "Decomissioned tools" section)
 
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=====Contact Aligners (Optical Exposure)=====
=====Contact Aligners (Optical Exposure)=====


*[[Suss Aligners (SUSS MJB-3)]]
*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[DUV Flood Expose]]
*[[DUV Flood Expose]]
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Maskless Aligner (Heidelberg MLA150)]]
*[[Maskless Aligner (Heidelberg MLA150)]]
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*[[RIE 2 (MRC)]]
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[RIE 5 (PlasmaTherm)]]


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=====ICP-RIE=====
=====ICP-RIE=====


*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 1 (Panasonic E646V)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP Etch 2 (Panasonic E626I)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]


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=Packaging=
=Packaging=
''Back-end Fabrication Tools''
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{|
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*[[Dicing Saw (ADT)]]
*[[Dicing Saw (ADT)]]
*[[Wafer Cleaver (PELCO Flip-Scribe)|Wafer Cleaver (PELCO Flipscribe)]]
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]


====Other Packaging====
====Other Packaging====
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=Inspection, Test and Characterization=
=Measurement & Characterization=
''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
{|
{|
|- valign="top"
|- valign="top"
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]


=====Electron Microscopy=====
=====Electron Microscopy=====


*[[Field Emission SEM 1 (FEI Sirion)]]
*[[SEM 1 (JEOL IT800SHL)]]
*[[Field Emission SEM 2 (JEOL 7600F)]]
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
*[[SEM Sample Coater (Hummer)]]
*[[SEM Sample Coater (Hummer)]]


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*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
*[[Photoluminescence PL Setup (Custom)]]
*[[Photoluminescence PL Setup (Custom)]]
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
**''Surface hydrophobicity''
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== [[Decomissioned Tools]] ==
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

Latest revision as of 22:28, 6 August 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties

Decomissioned Tools

Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.