Tool List: Difference between revisions
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=Lithography= |
=Lithography= |
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=====Photoresists and Lithography Chemicals===== |
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* [[Suss Aligners (SUSS MJB-3)]] |
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* [[IR Aligner (SUSS MJB-3 IR)]] |
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*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
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* [[DUV Flood Expose]] |
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*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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* [[Ovens 1, 2 & 3 (Labline)]] |
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* [[Oven 4 (Fisher)]] |
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=====Contact Aligners (Optical Exposure)===== |
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* [[Oven 5 (Blue M)]] |
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* [[Vacuum Oven (YES)]] |
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*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]] |
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* [[Holographic Lith/PL Setup]] |
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*[[Contact Aligner (SUSS MA-6)]] |
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|width=400| |
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*[[DUV Flood Expose]] |
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* [[Stepper 2 (AutoStep 200)]] |
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=====Direct-Write Lithography===== |
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* [[Stepper 3 (ASML)]] |
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* [[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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* [[Nano-Imprint Tool (Nanonex NX2000)]] |
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*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]] |
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* [[Contact Aligner (SUSS MA-6)]] |
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*[[Focused Ion-Beam Lithography (Raith Velion)]] |
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*[[Maskless Aligner (Heidelberg MLA150)]] |
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=====Other Patterning Systems===== |
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*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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=====Steppers (Optical Exposure)===== |
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*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]] |
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*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]] |
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*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]] |
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=====Thermal Processing for Photolithography===== |
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*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]] |
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*[[Ovens 1, 2 & 3 (Labline)]] |
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*[[Oven 4 (Fisher)]] |
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*[[Oven 5 (Labline)]] |
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*[[High Temp Oven (Blue M)]] |
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=====Lithography Support===== |
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*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
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*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches |
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*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
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=Vacuum Deposition= |
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====Physical Vapor Deposition (PVD)==== |
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*[[E-Beam 1 (Sharon)]] |
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*[[E-Beam 2 (Custom)]] |
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*[[E-Beam 3 (Temescal)]] |
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*[[E-Beam 4 (CHA)]] |
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*[[Sputter 1 (Custom)]] |
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*[[Sputter 2 (SFI Endeavor)]] |
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*[[Sputter 3 (ATC 2000-F)]] |
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*[[Sputter 4 (ATC 2200-V)]] |
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*[[Sputter 5 (Lesker AXXIS)]] |
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=====Thermal Evaporation===== |
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*[[PECVD 1 (PlasmaTherm 790)]] |
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*[[ |
*[[E-Beam 1 (Sharon)]] |
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*[[ |
*[[E-Beam 2 (Custom)]] |
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*[[ |
*[[E-Beam 3 (Temescal)]] |
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*[[ |
*[[E-Beam 4 (CHA)]] |
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*[[ |
*[[E-Beam 5 (Plasys)]] |
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*[[ |
*[[Thermal Evap 1]] |
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*[[ |
*[[Thermal Evap 2 (Solder)]] |
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=====Sputter Deposition===== |
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*[[Sputter 3 (AJA ATC 2000-F)]] |
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*[[Sputter 4 (AJA ATC 2200-V)]] |
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*[[Sputter 5 (AJA ATC 2200-V)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
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*[[SEM Sample Coater (Hummer)]] |
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=====Chemical Vapor Deposition (CVD)===== |
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*[[PECVD 1 (PlasmaTherm 790)]] |
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*[[PECVD 2 (Advanced Vacuum)]] |
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*[[ICP-PECVD (Unaxis VLR)]] |
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*[[Molecular Vapor Deposition]] |
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*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]] |
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=Dry Etch= |
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{| |
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=====Reactive Ion Etching (RIE)===== |
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*[[RIE 1 (Custom)]] |
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*[[RIE 2 (MRC)]] |
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*[[RIE 3 (MRC)]] |
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*[[RIE 5 (PlasmaTherm)]] |
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*[[Si Deep RIE (Bosch Etch)]] |
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*[[Ashers (Technics PEII)]] |
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*[[Unaxis VLR ICP-Etch]] |
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*[[RIE 2 (MRC)]] |
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| width="400" | |
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*[[ |
*[[RIE 5 (PlasmaTherm)]] |
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*[[ICP Etch 2 (Panasonic E640)]] |
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=====Plasma Etching and Cleaning===== |
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*[[UV Ozone Reactor]] |
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*[[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (YES EcoClean)]] |
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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*[[ |
*[[Ashers (Technics PEII)]] |
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=====Etch Monitoring===== |
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*[[Laser Etch Monitoring]] (Endpoint Detection) |
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*Optical Emission Spectra |
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*Residual Gas Analyzer (RGA) |
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| width="400" | |
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=====ICP-RIE===== |
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*[[ICP Etch 1 (Panasonic E646V)]] |
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*[[ICP Etch 2 (Panasonic E626I)]] |
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*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
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=====Ion Milling and Reactive Ion Beam Etching===== |
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*[[CAIBE (Oxford Ion Mill)]] |
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*[[Focused Ion-Beam Lithography (Raith Velion)]] |
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=====Other Dry Etching===== |
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*[[UV Ozone Reactor]] |
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*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
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*[[Vapor HF Etch]] |
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=Wet Processing= |
=Wet Processing= |
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See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc. |
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{| |
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*[[Wet Benches]] |
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**[[Solvent Cleaning Benches]] |
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**[[Spin Coat Benches]] |
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**[[Develop Benches]] |
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* [[Chemical-Mechanical Polisher (Logitech)]] |
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**[[Toxic Corrosive Benches]] |
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|width=400| |
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**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]] |
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* Wet Benches |
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**[[ |
**[[HF/TMAH Processing Benches]] |
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**[[Plating Bench]] |
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**[[Photoresist Spin Coat Benches]] |
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*[[Gold Plating Bench]] |
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*[[Critical Point Dryer]] |
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*[[Spin Rinse Dryer (SemiTool)]] |
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*[[Chemical-Mechanical Polisher (Logitech)]] |
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*[[Mechanical Polisher (Allied)]] |
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*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)] |
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=Thermal Processing= |
=Thermal Processing= |
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* [[Rapid Thermal Processor (AET RX6)]] |
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* [[Strip Annealer]] |
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* [[Tube Furnace (Tystar 8300)]] |
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*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]] |
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* [[Tube Furnace Wafer Bonding (Thermco)]] |
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*[[Rapid Thermal Processor (SSI Solaris 150)]] |
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* [[Tube Furnace AlGaAs Oxidation (Linberg)]] |
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*[[Tube Furnace (Tystar 8300)]] |
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*[[Tube Furnace Wafer Bonding (Thermco)]] |
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*[[Tube Furnace AlGaAs Oxidation (Lindberg)]] |
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*[[Wafer Bonder (SUSS SB6-8E)]] |
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*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]] |
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**[[Ovens 1, 2 & 3 (Labline)]] |
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**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
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**[[Oven 5 (Labline)]] |
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**[[High Temp Oven (Blue M)]] |
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|- |
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=Packaging= |
=Packaging= |
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''Back-end Fabrication Tools'' |
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* [[Flip-Chip Bonder (Finetech)]] |
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{| |
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* [[Vacuum Sealer]] |
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* [[Dicing Saw (ADT)]] |
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====Die Singulation / Down-sizing==== |
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* [[Wire Saw (Takatori)]] |
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*[[Dicing Saw (ADT)]] |
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=Inspection, Test and Characterization= |
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*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]] |
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*[[Automated Wafer Cleaver (Loomis LSD-155LT)]] |
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====Other Packaging==== |
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*[[Vacuum Sealer]] |
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====Wafer/Die Bonding==== |
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*[[Flip-Chip Bonder (Finetech)]] |
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*[[Wafer Bonder (SUSS SB6-8E)]] |
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*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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=Measurement & Characterization= |
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''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools'' |
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{| |
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=====Optical Microscopy===== |
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* [[Field Emission SEM 1 (FEI Sirion)]] |
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* [[Field Emission SEM 2 (JEOL 7600F)]] |
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*[[Microscopes|Optical Microscopes]] - ''General Use'' |
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* [[Step Profile (Dektak IIA)]] |
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*[[Fluorescence Microscope (Olympus MX51)]] |
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*[[Deep UV Optical Microscope (Olympus)]] |
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* [[Ellipsometer (Rudolph)]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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* [[Microscopes]] |
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*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
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* [[Probe Station & Curve Tracer]] |
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*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]] |
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* [[Optical Film Thickness (Filmetrics)]] |
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* [[Optical Film Thickness (Nanometric)]] |
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=====Electron Microscopy===== |
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* [[Goniometer]] |
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|width=400| |
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*[[SEM 1 (JEOL IT800SHL)]] |
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*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]] |
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* [[SEM Sample Coater (Hummer)]] |
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*[[SEM Sample Coater (Hummer)]] |
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* [[Surface Analysis (KLA/Tencor Surfscan)]] |
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* [[Photo-emission & IR Microscope (QFI)]] |
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=====Topographical Metrology===== |
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* [[Ellipsometer (Woollam)]] |
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* [[4-Point Probe Resistivity Mapper]] |
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*[[Step Profilometer (KLA Tencor P-7)]] |
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* [[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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*[[Step Profilometer (DektakXT)]] |
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* [[Deep UV Optical Microscope (Olympus)]] |
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*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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=====Thin-Film/Material Analysis===== |
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======Thickness + Optical Constants====== |
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*[[Ellipsometer (Woollam)]] |
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*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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======Electrical Analysis====== |
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*[[Resistivity Mapper (CDE RESMAP)]] |
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
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*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
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======Other Properties====== |
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*[[Film Stress (Tencor Flexus)]] |
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*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]] |
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*[[Photoluminescence PL Setup (Custom)]] |
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== [[Decomissioned Tools]] == |
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Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes. |
Latest revision as of 22:28, 6 August 2024
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
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ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |
Decomissioned Tools
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.