Tool List: Difference between revisions
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→Lithography: deleted Stepper 1 |
→Thermal Processing: deleted suss bonder |
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*[[Focused Ion-Beam Lithography (Raith Velion)]] |
*[[Focused Ion-Beam Lithography (Raith Velion)]] |
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*[[Maskless Aligner (Heidelberg MLA150)]] |
*[[Maskless Aligner (Heidelberg MLA150)]] |
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*[[Maskless Aligner (Raith PicoMaster XF)]] |
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=====Other Patterning Systems===== |
=====Other Patterning Systems===== |
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*[[Tube Furnace Wafer Bonding (Thermco)]] |
*[[Tube Furnace Wafer Bonding (Thermco)]] |
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*[[Tube Furnace AlGaAs Oxidation (Lindberg)]] |
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]] |
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*[[Wafer Bonder (SUSS SB6-8E)]] |
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*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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| width="400" | |
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*[[Flip-Chip Bonder (Finetech)]] |
*[[Flip-Chip Bonder (Finetech)]] |
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*[[Wafer Bonder (SUSS SB6-8E)]] |
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*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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==== |
==== <big>Inspection</big> ==== |
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=====Microscopes 🔬===== |
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*[[Microscopes|Optical Microscopes]] - ''General Use'' |
*[[Microscopes|Optical Microscopes]] - ''General Use'' |
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*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]] |
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]] |
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=====Electron |
=====Electron Microscopes 🦠===== |
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*[[SEM 1 (JEOL IT800SHL)]] |
*[[SEM 1 (JEOL IT800SHL)]] |
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*[[SEM Sample Coater (Hummer)]] |
*[[SEM Sample Coater (Hummer)]] |
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===== |
=====Topology / Profilometer 🏔️===== |
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*[[Step Profilometer (KLA Tencor P-7)]] |
*[[Step Profilometer (KLA Tencor P-7)]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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==== <big>Thin-Film/Material Analysis</big> ==== |
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===== |
======Optical 🔦====== |
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======Thickness + Optical Constants====== |
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*[[Ellipsometer (Woollam)]] |
*[[Ellipsometer (Woollam)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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======Electrical |
======Electrical ⚡️====== |
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*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
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*[[IR Thermal Microscope (QFI)|Thermal HotSpot IR Microscope (QFI)]] |
*[[IR Thermal Microscope (QFI)|Thermal HotSpot IR Microscope (QFI)]] |
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======Other |
======Other 🔍====== |
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*[[Film Stress (Tencor Flexus)]] |
*[[Film Stress (Tencor Flexus)]] |
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Latest revision as of 23:00, 10 November 2026
Tool Categories |
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
InspectionMicroscopes 🔬
Electron Microscopes 🦠Topology / Profilometer 🏔️ |
Thin-Film/Material AnalysisOptical 🔦
Electrical ⚡️
Other 🔍 |
Decomissioned Tools
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.