Tool List: Difference between revisions

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(→‎Lithography: removed "FEI" text)
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (Sirion Nabity v9)]]
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Maskless Aligner (Heidelberg MLA150)]]
*[[Maskless Aligner (Heidelberg MLA150)]]

Revision as of 19:08, 23 February 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties