Tool List: Difference between revisions
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(→ICP-RIE: corrected Pan model numbers & links) |
(→Lithography: removed "FEI" text) |
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography ( |
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (Sirion Nabity v9)]] |
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*[[Focused Ion-Beam Lithography (Raith Velion)]] |
*[[Focused Ion-Beam Lithography (Raith Velion)]] |
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*[[Maskless Aligner (Heidelberg MLA150)]] |
*[[Maskless Aligner (Heidelberg MLA150)]] |
Revision as of 19:08, 23 February 2024
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |