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Showing below up to 111 results in range #1 to #111.
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- Digital Microscope (Olympus DSX1000) (3 categories)
- Optical Film Thickness (Filmetrics) (3 categories)
- Surface Analysis (KLA/Tencor Surfscan) (3 categories)
- Lithography Recipes (3 categories)
- Molecular Vapor Deposition (3 categories)
- Wafer Bonder (Logitech WBS7) (3 categories)
- Optical Film Thickness (Nanometric) (3 categories)
- Suss Aligners (SUSS MJB-3) (3 categories)
- Automated Wafer Cleaver (Loomis LSD-155LT) (3 categories)
- Ellipsometer (Rudolph) (3 categories)
- Photoluminescence PL Setup (Custom) (3 categories)
- Tube Furnace AlGaAs Oxidation (Lindberg) (3 categories)
- Ellipsometer (Woollam) (3 categories)
- Critical Point Dryer (3 categories)
- Resistivity Mapper (CDE RESMAP) (3 categories)
- Wafer Cleaver (PELCO Flip-Scribe) (3 categories)
- Plasma Clean (Gasonics 2000) (3 categories)
- UV Ozone Reactor (3 categories)
- Step Profilometer (DektakXT) (3 categories)
- Wet Benches (3 categories)
- Oven 5 (Labline) (3 categories)
- Plasma Clean (YES EcoClean) (3 categories)
- SEM 1 (JEOL IT800SHL) (3 categories)
- DUMMY TOOL (3 categories)
- Step Profilometer (KLA Tencor P-7) (3 categories)
- Ovens 1, 2 & 3 (Labline) (3 categories)
- Film Stress (Tencor Flexus) (3 categories)
- Probe Station & Curve Tracer (3 categories)
- SEM Sample Coater (Hummer) (3 categories)
- Vacuum Oven (YES) (3 categories)
- DUV Flood Expose (3 categories)
- Oxford ICP Etcher (PlasmaPro 100 Cobra) (3 categories)
- Filmetrics F40-UV Microscope-Mounted (3 categories)
- Vacuum Sealer (3 categories)
- Ashers (Technics PEII) (3 categories)
- Spin Rinse Dryer (SemiTool) (3 categories)
- Deep UV Optical Microscope (Olympus) (3 categories)
- E-Beam 5 (Plasys) (3 categories)
- Laser Etch Monitoring (3 categories)
- Microscopes (3 categories)
- Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX) (3 categories)
- Fluorescence Microscope (Olympus MX51) (3 categories)
- Optical Film Thickness & Wafer-Mapping (Filmetrics F50) (3 categories)
- Strip Annealer (3 categories)
- Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP) (2 categories)
- Sputter 3 (AJA ATC 2000-F) (2 categories)
- ICP-PECVD (Unaxis VLR) (2 categories)
- Automated Coat/Develop System (S-Cubed Flexi) (2 categories)
- E-Beam Lithography System (JEOL JBX-6300FS) (2 categories)
- Tube Furnace (Tystar 8300) (2 categories)
- Contact Aligner (SUSS MA-6) (2 categories)
- Focused Ion-Beam Lithography (Raith Velion) (2 categories)
- Rapid Thermal Processor (AET RX6) (2 categories)
- Sputter 4 (AJA ATC 2200-V) (2 categories)
- Direct-Write Lithography Recipes (2 categories)
- ICP Etch 1 (Panasonic E646V) (2 categories)
- Contact Alignment Recipes (2 categories)
- Rapid Thermal Processor (SSI Solaris 150) (2 categories)
- Sputter 5 (AJA ATC 2200-V) (2 categories)
- Wafer Bonder (SUSS SB6-8E) (2 categories)
- ICP Etch 2 (Panasonic E626I) (2 categories)
- Thermal Evap 1 (2 categories)
- Plasma Activation (EVG 810) (2 categories)
- Tube Furnace Wafer Bonding (Thermco) (2 categories)
- GCA 6300 Mask Making Guidance (2 categories)
- Nano-Imprint (Nanonex NX2000) (2 categories)
- Oven 4 (Thermo-Fisher HeraTherm) (2 categories)
- Thermal Evap 2 (Solder) (2 categories)
- DSEIII (PlasmaTherm/Deep Silicon Etcher) (2 categories)
- Gold Plating Bench (2 categories)
- E-Beam 1 (Sharon) (2 categories)
- IR Aligner (SUSS MJB-3 IR) (2 categories)
- Field Emission SEM 2 (JEOL IT800SHL) (2 categories)
- HF Vapor Etch (2 categories)
- Nick test (2 categories)
- E-Beam 2 (Custom) (2 categories)
- IR Thermal Microscope (QFI) (2 categories)
- Thermal Evaporator 1 (2 categories)
- Maskless Aligner (Heidelberg MLA150) (2 categories)
- High Temp Oven (Blue M) (2 categories)
- Stepper 1 (GCA 6300) (2 categories)
- Wire Saw (Takatori) (2 categories)
- E-Beam 3 (Temescal) (2 categories)
- Ion Beam Deposition (Veeco NEXUS) (2 categories)
- Thermal Evaporator 2 (2 categories)
- Mechanical Polisher (Allied) (2 categories)
- RIE 1 (Custom) (2 categories)
- Holographic Lith/PL Setup (Custom) (2 categories)
- Stepper 2 (AutoStep 200) (2 categories)
- XeF2 Etch (Xetch) (2 categories)
- E-Beam 4 (CHA) (2 categories)
- Thermal Processing Recipes (2 categories)
- CAIBE (Oxford Ion Mill) (2 categories)
- Flip-Chip Bonder (Finetech) (2 categories)
- RIE 2 (MRC) (2 categories)
- Vapor HF Etch (2 categories)
- Stepper 3 (ASML DUV) (2 categories)
- Atomic Force Microscope (Bruker ICON) (2 categories)
- PECVD 1 (PlasmaTherm 790) (2 categories)
- Chemical-Mechanical Polisher (Logitech) (2 categories)
- RIE 3 (MRC) (2 categories)
- Sputter 1 (Custom) (2 categories)
- Vapor HF Etch (uETCH) (2 categories)
- Stepper Recipes (2 categories)
- Atomic Layer Deposition (Oxford FlexAL) (2 categories)
- Laser Scanning Confocal M-scope (Olympus LEXT) (2 categories)
- PECVD 2 (Advanced Vacuum) (2 categories)
- RIE 5 (PlasmaTherm) (2 categories)
- Sputter 2 (SFI Endeavor) (2 categories)
- Dicing Saw (ADT) (2 categories)
- ICP-Etch (Unaxis VLR) (2 categories)