Difference between revisions of "Tool List"

From UCSB Nanofab Wiki
Jump to navigation Jump to search
(→‎Electron Microscopy: renamed and fixed link for SEM2)
 
(96 intermediate revisions by 10 users not shown)
Line 1: Line 1:
 
__NOTOC__
 
__NOTOC__
 
=Lithography=
 
=Lithography=
 +
 
{|
 
{|
−
|-valign="top"
+
|- valign="top"
−
|width=300|
+
| width="300" |
−
* [[Suss Aligners (SUSS MJB-3)]]
+
=====Photoresists and Lithography Chemicals=====
−
* [[IR Aligner (SUSS MJB-3 IR)]]
+
 
−
* [[DUV Flood Expose]]
+
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
−
* [[Ovens 1, 2 & 3 (Labline)]]
+
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
−
* [[Oven 4 (Fisher)]]
+
 
−
* [[Oven 5 (Labline)]]
+
=====Contact Aligners (Optical Exposure)=====
−
* [[High Temp Oven (Blue M)]]
+
 
−
* [[Vacuum Oven (YES)]]
+
*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
−
* [[Holographic Lith/PL Setup (Custom)]]
+
*[[Contact Aligner (SUSS MA-6)]]
−
|width=400|
+
*[[DUV Flood Expose]]
−
* [[Stepper 1 (GCA 6300)]]
+
 
−
* [[Stepper 2 (AutoStep 200)]]
+
=====Direct-Write Lithography=====
−
* [[Stepper 3 (ASML DUV)]]
+
 
−
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
+
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
−
* [[Nano-Imprint (Nanonex NX2000)]]
+
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
−
* [[Contact Aligner (SUSS MA-6)]]
+
*[[Focused Ion-Beam Lithography (Raith Velion)]]
 +
*[[Maskless Aligner (Heidelberg MLA150)]]
 +
 
 +
=====Other Patterning Systems=====
 +
 
 +
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
 +
| width="400" |
 +
=====Steppers (Optical Exposure)=====
 +
 
 +
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
 +
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
 +
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
 +
 
 +
=====Thermal Processing for Photolithography=====
 +
 
 +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
 +
*[[Ovens 1, 2 & 3 (Labline)]]
 +
*[[Oven 4 (Fisher)]]
 +
*[[Oven 5 (Labline)]]
 +
*[[High Temp Oven (Blue M)]]
 +
 
 +
=====Lithography Support=====
 +
 
 +
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
 +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
 +
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
 
|-
 
|-
 
|}
 
|}
  
−
= Vacuum Deposition =
+
=Vacuum Deposition=
  
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
−
| width="300" |  
+
| width="300" |
−
*[[E-Beam 1 (Sharon)]]
+
====Physical Vapor Deposition (PVD)====
−
*[[E-Beam 2 (Custom)]]
 
−
*[[E-Beam 3 (Temescal)]]
 
−
*[[E-Beam 4 (CHA)]]
 
−
*[[Sputter 2 (SFI Endeavor)]]
 
−
*[[Sputter 3 (AJA ATC 2000-F)]]
 
−
*[[Sputter 4 (AJA ATC 2200-V)]]
 
−
*[[Sputter 5 (Lesker AXXIS)]]
 
  
−
| width="400" |
+
=====Thermal Evaporation=====
−
*[[PECVD 1 (PlasmaTherm 790)]]  
+
 
−
*[[PECVD 2 (Advanced Vacuum)]]  
+
*[[E-Beam 1 (Sharon)]]
−
*[[Thermal Evap 1]]  
+
*[[E-Beam 2 (Custom)]]
−
*[[Thermal Evap 2 (Solder)]]  
+
*[[E-Beam 3 (Temescal)]]
−
*[[ICP-PECVD (Unaxis VLR)]]  
+
*[[E-Beam 4 (CHA)]]
−
*[[Ion Beam Deposition (Veeco NEXUS)]]  
+
*[[E-Beam 5 (Plasys)]]
−
*[[Molecular Vapor Deposition]]  
+
*[[Thermal Evap 1]]
−
*[[Atomic Layer Deposision (Oxford FlexAL)]]
+
*[[Thermal Evap 2 (Solder)]]
 +
 
 +
=====Sputter Deposition=====
 +
 
 +
*[[Sputter 3 (AJA ATC 2000-F)]]
 +
*[[Sputter 4 (AJA ATC 2200-V)]]
 +
*[[Sputter 5 (AJA ATC 2200-V)]]
 +
*[[Ion Beam Deposition (Veeco NEXUS)]]
 +
*[[SEM Sample Coater (Hummer)]]
 +
 
 +
| width="400" |
 +
=====Chemical Vapor Deposition (CVD)=====
 +
 
 +
*[[PECVD 1 (PlasmaTherm 790)]]
 +
*[[PECVD 2 (Advanced Vacuum)]]
 +
*[[ICP-PECVD (Unaxis VLR)]]
 +
*[[Molecular Vapor Deposition]]
 +
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
  
 
|}
 
|}
  
−
= Dry Etch =
+
=Dry Etch=
  
 
{|
 
{|
 
|- valign="top"
 
|- valign="top"
−
| width="300" |
+
| width="300" |
−
*[[RIE 2 (MRC)]]  
+
=====Reactive Ion Etching (RIE)=====
−
*[[RIE 3 (MRC)]]  
+
 
−
*[[RIE 5 (PlasmaTherm)]]  
+
*[[RIE 2 (MRC)]]
−
*[[Si Deep RIE (PlasmaTherm/Bosch Etch)]]  
+
*[[RIE 3 (MRC)]]
−
*[[Ashers (Technics PEII)]]  
+
*[[RIE 5 (PlasmaTherm)]]
−
*[[UV Ozone Reactor]]  
+
 
−
*[[CAIBE (Oxford Ion Mill)]]
+
=====Plasma Etching and Cleaning=====
−
| width="400" |  
+
 
−
*[[ICP Etch 1 (Panasonic E626I)]]  
+
*[[Plasma Clean (YES EcoClean)]]
−
*[[ICP Etch 2 (Panasonic E640)]]  
+
*[[Plasma Activation (EVG 810)]]
 +
*[[Ashers (Technics PEII)]]
 +
 
 +
=====Etch Monitoring=====
 +
 
 +
*[[Laser Etch Monitoring]] (Endpoint Detection)
 +
*Optical Emission Spectra
 +
*Residual Gas Analyzer (RGA)
 +
| width="400" |
 +
=====ICP-RIE=====
 +
 
 +
*[[ICP Etch 1 (Panasonic E626I)]]
 +
*[[ICP Etch 2 (Panasonic E640)]]
 
*[[ICP-Etch (Unaxis VLR)]]
 
*[[ICP-Etch (Unaxis VLR)]]
−
*[[Plasma Clean (Gasonics 2000)]]  
+
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
−
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
+
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
−
*[[Plasma Activation (EVG 810)]]  
+
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
 +
 
 +
=====Ion Milling and Reactive Ion Beam Etching=====
 +
 
 +
*[[CAIBE (Oxford Ion Mill)]]
 +
*[[Focused Ion-Beam Lithography (Raith Velion)]]
 +
 
 +
=====Other Dry Etching=====
 +
 
 +
*[[UV Ozone Reactor]]
 +
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
 
*[[Vapor HF Etch]]
 
*[[Vapor HF Etch]]
  
Line 73: Line 131:
  
 
=Wet Processing=
 
=Wet Processing=
 +
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
 
{|
 
{|
−
|-valign="top"
+
|- valign="top"
−
|width=300|
+
| width="300" |
−
* [[Wet Benches]]
+
*[[Wet Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Solvent Cleaning Benches]]
 
**[[Spin Coat Benches]]
 
**[[Spin Coat Benches]]
 
**[[Develop Benches]]
 
**[[Develop Benches]]
 
**[[Toxic Corrosive Benches]]
 
**[[Toxic Corrosive Benches]]
 +
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
 
**[[HF/TMAH Processing Benches]]
 
**[[HF/TMAH Processing Benches]]
 
**[[Plating Bench]]
 
**[[Plating Bench]]
−
|width=400|
+
| width="400" |
−
* [[Gold Plating Bench]]
+
*[[Gold Plating Bench]]
−
* [[Critical Point Dryer]]
+
*[[Critical Point Dryer]]
−
* [[Spin Rinse Dryer (SemiTool)]]
+
*[[Spin Rinse Dryer (SemiTool)]]
−
* [[Chemical-Mechanical Polisher (Logitech)]]
+
*[[Chemical-Mechanical Polisher (Logitech)]]
 +
*[[Mechanical Polisher (Allied)]]
 +
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
 +
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
 
|-
 
|-
 
|}
 
|}
  
 
=Thermal Processing=
 
=Thermal Processing=
−
* [[Rapid Thermal Processor (AET RX6)]]
+
{|
−
* [[Strip Annealer]]
+
|- valign="top"
−
* [[Tube Furnace (Tystar 8300)]]
+
| width="400" |
−
* [[Tube Furnace Wafer Bonding (Thermco)]]
+
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
−
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
+
*[[Rapid Thermal Processor (SSI Solaris 150)]]
−
* [[Wafer Bonder (SUSS SB6-8E)]]
+
*[[Tube Furnace (Tystar 8300)]]
 +
*[[Tube Furnace Wafer Bonding (Thermco)]]
 +
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
 +
*[[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
 +
| width="400" |
 +
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
 +
**[[Ovens 1, 2 & 3 (Labline)]]
 +
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
 +
**[[Oven 5 (Labline)]]
 +
**[[High Temp Oven (Blue M)]]
 +
|-
 +
|}
  
 
=Packaging=
 
=Packaging=
−
* [[Dicing Saw (ADT)]]
+
{|
−
* [[Flip-Chip Bonder (Finetech)]]
+
|
−
* [[Vacuum Sealer]]
+
====Die Singulation / Down-sizing====
−
* [[Wire Saw (Takatori)]]
+
 
 +
*[[Dicing Saw (ADT)]]
 +
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
 +
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]
 +
 
 +
====Other Packaging====
 +
 
 +
*[[Vacuum Sealer]]
 +
|
 +
====Wafer/Die Bonding====
 +
 
 +
*[[Flip-Chip Bonder (Finetech)]]
 +
 
 +
*[[Wafer Bonder (SUSS SB6-8E)]]
 +
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
 +
|}
  
 
=Inspection, Test and Characterization=
 
=Inspection, Test and Characterization=
 
{|
 
{|
−
|-valign="top"
+
|- valign="top"
−
|width=300|
+
| width="300" |
−
* [[Field Emission SEM 1 (FEI Sirion)]]
+
=====Optical Microscopy=====
−
* [[Field Emission SEM 2 (JEOL 7600F)]]
+
 
−
* [[Step Profile (Dektak IIA)]]
+
*[[Microscopes|Optical Microscopes]] - ''General Use''
−
* [[Step Profilometer (Dektak 6M)]]
+
*[[Fluorescence Microscope (Olympus MX51)]]
−
* [[Ellipsometer (Rudolph)]]
+
*[[Deep UV Optical Microscope (Olympus)]]
−
* [[Microscopes]]
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
−
* [[Probe Station & Curve Tracer]]
+
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
−
* [[Optical Film Thickness (Filmetrics)]]
+
 
−
* [[Optical Film Thickness (Nanometric)]]
+
=====Electron Microscopy=====
−
* [[Goniometer]]
+
 
−
|width=400|
+
*[[SEM 1 (JEOL IT800SHL)]]
−
* [[Film Stress (Tencor Flexus)]]
+
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
−
* [[SEM Sample Coater (Hummer)]]
+
*[[SEM Sample Coater (Hummer)]]
−
* [[Surface Analysis (KLA/Tencor Surfscan)]]
+
 
−
* [[Photo-emission & IR Microscope (QFI)]]
+
=====Topographical Metrology=====
−
* [[Ellipsometer (Woollam)]]
+
 
−
* [[Resistivity Mapper (CDE RESMAP)]]
+
*[[Step Profilometer (KLA Tencor P-7)]]
−
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
+
*[[Step Profilometer (DektakXT)]]
−
* [[Deep UV Optical Microscope (Olympus)]]
+
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
−
* [[Fluorescence Microscope (Olympus MX51)]]  
+
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
−
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
+
| width="400" |
 +
 
 +
=====Thin-Film/Material Analysis=====
 +
 
 +
======Thickness + Optical Constants======
 +
 
 +
*[[Ellipsometer (Woollam)]]
 +
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
 +
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
 +
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
 +
 
 +
======Electrical Analysis======
 +
 
 +
*[[Resistivity Mapper (CDE RESMAP)]]
 +
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
 +
*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
 +
 
 +
======Other Properties======
 +
 
 +
*[[Film Stress (Tencor Flexus)]]
 +
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
 +
*[[Photoluminescence PL Setup (Custom)]]
 +
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
 +
**''Surface hydrophobicity''
 
|-
 
|-
 
|}
 
|}

Latest revision as of 15:33, 12 September 2023

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Inspection, Test and Characterization

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties
Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=161293"