Difference between revisions of "Tool List"
Jump to navigation
Jump to search
(→Optical Microscopy: link to MJB-IR IR scope) |
|||
(108 intermediate revisions by 10 users not shown) | |||
Line 1: | Line 1: | ||
__NOTOC__ |
__NOTOC__ |
||
=Lithography= |
=Lithography= |
||
+ | |||
{| |
{| |
||
− | |-valign="top" |
+ | |- valign="top" |
− | |width=300| |
+ | | width="300" | |
+ | =====Photoresists and Lithography Chemicals===== |
||
− | * [[Suss Aligners (SUSS MJB-3)]] |
||
+ | |||
− | * [[IR Aligner (SUSS MJB-3 IR)]] |
||
+ | *See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
||
− | * [[DUV Flood Expose]] |
||
+ | *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
||
− | * [[Ovens 1, 2 & 3 (Labline)]] |
||
+ | |||
− | * [[Oven 4 (Fisher)]] |
||
+ | =====Contact Aligners (Optical Exposure)===== |
||
− | * [[High Temp Oven (Blue M)]] |
||
+ | |||
− | * [[Vacuum Oven (YES)]] |
||
+ | *[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]] |
||
− | * [[Holographic Lith/PL Setup (Custom)]] |
||
+ | *[[Contact Aligner (SUSS MA-6)]] |
||
− | |width=400| |
||
− | * |
+ | *[[DUV Flood Expose]] |
+ | |||
− | * [[Stepper 2 (AutoStep 200)]] |
||
+ | =====Direct-Write Lithography===== |
||
− | * [[Stepper 3 (ASML DUV)]] |
||
+ | |||
− | * [[E-Beam Lithography System (JEOL JBX-6300FS)]] |
||
+ | *[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
||
− | * [[Nano-Imprint (Nanonex NX2000)]] |
||
+ | *[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]] |
||
− | * [[Contact Aligner (SUSS MA-6)]] |
||
+ | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
||
+ | *[[Maskless Aligner (Heidelberg MLA150)]] |
||
+ | |||
+ | =====Other Patterning Systems===== |
||
+ | |||
+ | *[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
||
+ | | width="400" | |
||
+ | =====Steppers (Optical Exposure)===== |
||
+ | |||
+ | *[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]] |
||
+ | *[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]] |
||
+ | *[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]] |
||
+ | |||
+ | =====Thermal Processing for Photolithography===== |
||
+ | |||
+ | *[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]] |
||
+ | *[[Ovens 1, 2 & 3 (Labline)]] |
||
+ | *[[Oven 4 (Fisher)]] |
||
+ | *[[Oven 5 (Labline)]] |
||
+ | *[[High Temp Oven (Blue M)]] |
||
+ | |||
+ | =====Lithography Support===== |
||
+ | |||
+ | *The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
||
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches |
||
+ | *[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
||
|- |
|- |
||
|} |
|} |
||
− | = |
+ | =Vacuum Deposition= |
{| |
{| |
||
|- valign="top" |
|- valign="top" |
||
− | | width="300" | |
+ | | width="300" | |
+ | ====Physical Vapor Deposition (PVD)==== |
||
− | *[[E-Beam 1 (Sharon)]] |
||
− | *[[E-Beam 2 (Custom)]] |
||
− | *[[E-Beam 3 (Temescal)]] |
||
− | *[[E-Beam 4 (CHA)]] |
||
− | *[[Sputter 2 (SFI Endeavor)]] |
||
− | *[[Sputter 3 (AJA ATC 2000-F)]] |
||
− | *[[Sputter 4 (AJA ATC 2200-V)]] |
||
− | *[[Sputter 5 (Lesker AXXIS)]] |
||
+ | =====Thermal Evaporation===== |
||
− | | width="400" | |
||
+ | |||
− | *[[PECVD 1 (PlasmaTherm 790)]] |
||
− | *[[ |
+ | *[[E-Beam 1 (Sharon)]] |
− | *[[ |
+ | *[[E-Beam 2 (Custom)]] |
− | *[[ |
+ | *[[E-Beam 3 (Temescal)]] |
− | *[[ |
+ | *[[E-Beam 4 (CHA)]] |
− | *[[ |
+ | *[[E-Beam 5 (Plasys)]] |
− | *[[ |
+ | *[[Thermal Evap 1]] |
− | *[[ |
+ | *[[Thermal Evap 2 (Solder)]] |
+ | |||
+ | =====Sputter Deposition===== |
||
+ | |||
+ | *[[Sputter 3 (AJA ATC 2000-F)]] |
||
+ | *[[Sputter 4 (AJA ATC 2200-V)]] |
||
+ | *[[Sputter 5 (AJA ATC 2200-V)]] |
||
+ | *[[Ion Beam Deposition (Veeco NEXUS)]] |
||
+ | *[[SEM Sample Coater (Hummer)]] |
||
+ | |||
+ | | width="400" | |
||
+ | =====Chemical Vapor Deposition (CVD)===== |
||
+ | |||
+ | *[[PECVD 1 (PlasmaTherm 790)]] |
||
+ | *[[PECVD 2 (Advanced Vacuum)]] |
||
+ | *[[ICP-PECVD (Unaxis VLR)]] |
||
+ | *[[Molecular Vapor Deposition]] |
||
+ | *[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]] |
||
|} |
|} |
||
− | = |
+ | =Dry Etch= |
{| |
{| |
||
|- valign="top" |
|- valign="top" |
||
− | | width="300" | |
+ | | width="300" | |
+ | =====Reactive Ion Etching (RIE)===== |
||
− | *[[RIE 2 (MRC)]] |
||
+ | |||
− | *[[RIE 3 (MRC)]] |
||
− | *[[RIE |
+ | *[[RIE 2 (MRC)]] |
− | *[[ |
+ | *[[RIE 3 (MRC)]] |
− | *[[ |
+ | *[[RIE 5 (PlasmaTherm)]] |
+ | |||
− | *[[UV Ozone Reactor]] |
||
+ | =====Plasma Etching and Cleaning===== |
||
− | *[[CAIBE (Oxford Ion Mill)]] |
||
+ | |||
− | | width="400" | |
||
− | *[[ |
+ | *[[Plasma Clean (YES EcoClean)]] |
− | *[[ |
+ | *[[Plasma Activation (EVG 810)]] |
+ | *[[Ashers (Technics PEII)]] |
||
+ | |||
+ | =====Etch Monitoring===== |
||
+ | |||
+ | *[[Laser Etch Monitoring]] (Endpoint Detection) |
||
+ | *Optical Emission Spectra |
||
+ | *Residual Gas Analyzer (RGA) |
||
+ | | width="400" | |
||
+ | =====ICP-RIE===== |
||
+ | |||
+ | *[[ICP Etch 1 (Panasonic E646V)]] |
||
+ | *[[ICP Etch 2 (Panasonic E626I)]] |
||
*[[ICP-Etch (Unaxis VLR)]] |
*[[ICP-Etch (Unaxis VLR)]] |
||
− | *[[ |
+ | *[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
+ | *[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
||
− | *[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
||
+ | *[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
||
− | *[[Plasma Activation (EVG 810)]] |
||
+ | |||
+ | =====Ion Milling and Reactive Ion Beam Etching===== |
||
+ | |||
+ | *[[CAIBE (Oxford Ion Mill)]] |
||
+ | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
||
+ | |||
+ | =====Other Dry Etching===== |
||
+ | |||
+ | *[[UV Ozone Reactor]] |
||
+ | *[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]] |
||
*[[Vapor HF Etch]] |
*[[Vapor HF Etch]] |
||
Line 72: | Line 131: | ||
=Wet Processing= |
=Wet Processing= |
||
+ | See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc. |
||
{| |
{| |
||
− | |-valign="top" |
+ | |- valign="top" |
− | |width=300| |
+ | | width="300" | |
− | * |
+ | *[[Wet Benches]] |
**[[Solvent Cleaning Benches]] |
**[[Solvent Cleaning Benches]] |
||
**[[Spin Coat Benches]] |
**[[Spin Coat Benches]] |
||
**[[Develop Benches]] |
**[[Develop Benches]] |
||
**[[Toxic Corrosive Benches]] |
**[[Toxic Corrosive Benches]] |
||
+ | **[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]] |
||
**[[HF/TMAH Processing Benches]] |
**[[HF/TMAH Processing Benches]] |
||
**[[Plating Bench]] |
**[[Plating Bench]] |
||
− | |width=400| |
+ | | width="400" | |
− | * |
+ | *[[Gold Plating Bench]] |
− | * |
+ | *[[Critical Point Dryer]] |
− | * |
+ | *[[Spin Rinse Dryer (SemiTool)]] |
− | * |
+ | *[[Chemical-Mechanical Polisher (Logitech)]] |
+ | *[[Mechanical Polisher (Allied)]] |
||
+ | *[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
||
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)] |
||
|- |
|- |
||
|} |
|} |
||
=Thermal Processing= |
=Thermal Processing= |
||
+ | {| |
||
− | * [[Rapid Thermal Processor (AET RX6)]] |
||
+ | |- valign="top" |
||
− | * [[Strip Annealer]] |
||
+ | | width="400" | |
||
− | * [[Tube Furnace (Tystar 8300)]] |
||
+ | *[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]] |
||
− | * [[Tube Furnace Wafer Bonding (Thermco)]] |
||
+ | *[[Rapid Thermal Processor (SSI Solaris 150)]] |
||
− | * [[Tube Furnace AlGaAs Oxidation (Linberg)]] |
||
− | * |
+ | *[[Tube Furnace (Tystar 8300)]] |
+ | *[[Tube Furnace Wafer Bonding (Thermco)]] |
||
+ | *[[Tube Furnace AlGaAs Oxidation (Lindberg)]] |
||
+ | *[[Wafer Bonder (SUSS SB6-8E)]] |
||
+ | *[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
||
+ | | width="400" | |
||
+ | *[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]] |
||
+ | **[[Ovens 1, 2 & 3 (Labline)]] |
||
+ | **[[Oven 4 (Thermo-Fisher HeraTherm)]] |
||
+ | **[[Oven 5 (Labline)]] |
||
+ | **[[High Temp Oven (Blue M)]] |
||
+ | |- |
||
+ | |} |
||
=Packaging= |
=Packaging= |
||
+ | ''Back-end Fabrication Tools'' |
||
− | * [[Dicing Saw (ADT)]] |
||
+ | {| |
||
− | * [[Flip-Chip Bonder (Finetech)]] |
||
+ | | |
||
− | * [[Vacuum Sealer]] |
||
+ | ====Die Singulation / Down-sizing==== |
||
− | * [[Wire Saw (Takatori)]] |
||
+ | *[[Dicing Saw (ADT)]] |
||
− | =Inspection, Test and Characterization= |
||
+ | *[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]] |
||
+ | *[[Automated Wafer Cleaver (Loomis LSD-155LT)]] |
||
+ | |||
+ | ====Other Packaging==== |
||
+ | |||
+ | *[[Vacuum Sealer]] |
||
+ | | |
||
+ | ====Wafer/Die Bonding==== |
||
+ | |||
+ | *[[Flip-Chip Bonder (Finetech)]] |
||
+ | |||
+ | *[[Wafer Bonder (SUSS SB6-8E)]] |
||
+ | *[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
||
+ | |} |
||
+ | |||
+ | =Measurement & Characterization= |
||
+ | ''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools'' |
||
{| |
{| |
||
− | |-valign="top" |
+ | |- valign="top" |
− | |width=300| |
+ | | width="300" | |
+ | =====Optical Microscopy===== |
||
− | * [[Field Emission SEM 1 (FEI Sirion)]] |
||
+ | |||
− | * [[Field Emission SEM 2 (JEOL 7600F)]] |
||
+ | *[[Microscopes|Optical Microscopes]] - ''General Use'' |
||
− | * [[Step Profile (Dektak IIA)]] |
||
− | * |
+ | *[[Fluorescence Microscope (Olympus MX51)]] |
+ | *[[Deep UV Optical Microscope (Olympus)]] |
||
− | * [[Ellipsometer (Rudolph)]] |
||
+ | *[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
||
− | * [[Microscopes]] |
||
+ | *[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
||
− | * [[Probe Station & Curve Tracer]] |
||
+ | *[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]] |
||
− | * [[Optical Film Thickness (Filmetrics)]] |
||
+ | |||
− | * [[Optical Film Thickness (Nanometric)]] |
||
+ | =====Electron Microscopy===== |
||
− | * [[Goniometer]] |
||
+ | |||
− | |width=400| |
||
− | * |
+ | *[[SEM 1 (JEOL IT800SHL)]] |
+ | *[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]] |
||
− | * [[SEM Sample Coater (Hummer)]] |
||
+ | *[[SEM Sample Coater (Hummer)]] |
||
− | * [[Surface Analysis (KLA/Tencor Surfscan)]] |
||
+ | |||
− | * [[Photo-emission & IR Microscope (QFI)]] |
||
+ | =====Topographical Metrology===== |
||
− | * [[Ellipsometer (Woollam)]] |
||
+ | |||
− | * [[Resistivity Mapper (CDE RESMAP)]] |
||
+ | *[[Step Profilometer (KLA Tencor P-7)]] |
||
− | * [[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
||
+ | *[[Step Profilometer (DektakXT)]] |
||
− | * [[Deep UV Optical Microscope (Olympus)]] |
||
− | * |
+ | *[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
+ | *[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
||
− | * [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]] |
||
+ | | width="400" | |
||
+ | |||
+ | =====Thin-Film/Material Analysis===== |
||
+ | |||
+ | ======Thickness + Optical Constants====== |
||
+ | |||
+ | *[[Ellipsometer (Woollam)]] |
||
+ | *[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
||
+ | *[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
||
+ | *[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
||
+ | |||
+ | ======Electrical Analysis====== |
||
+ | |||
+ | *[[Resistivity Mapper (CDE RESMAP)]] |
||
+ | *[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
||
+ | *[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
||
+ | |||
+ | ======Other Properties====== |
||
+ | |||
+ | *[[Film Stress (Tencor Flexus)]] |
||
+ | *[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]] |
||
+ | *[[Photoluminescence PL Setup (Custom)]] |
||
|- |
|- |
||
|} |
|} |
Revision as of 11:52, 1 March 2024
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |