Tool List: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
m (Reverted edits by Mitchell (talk) to last revision by John d)
(Made a "Decomissioned tools" section)
 
(74 intermediate revisions by 9 users not shown)
Line 1: Line 1:
__NOTOC__
__NOTOC__
=Lithography=
=Lithography=

You can see our available photoresists on the [https://www.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemical_Datasheets Chemical Datasheets page].
{|
{|
|- valign="top"
|- valign="top"
| width="300" |
| width="300" |
=====Photoresists and Lithography Chemicals=====
===== Contact Aligners (Optical Exposure) =====
* [[Suss Aligners (SUSS MJB-3)]]
* [[IR Aligner (SUSS MJB-3 IR)]]
* [[Contact Aligner (SUSS MA-6)]]
* [[DUV Flood Expose]]


*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
===== Other Patterning Systems =====
* [[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]

* [[Nano-Imprint (Nanonex NX2000)]]
=====Contact Aligners (Optical Exposure)=====
* [[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]

*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[DUV Flood Expose]]

=====Direct-Write Lithography=====

*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Maskless Aligner (Heidelberg MLA150)]]

=====Other Patterning Systems=====

*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
| width="400" |
| width="400" |
===== Steppers (Optical Exposure) =====
=====Steppers (Optical Exposure)=====

* [[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
* [[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
* [[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]

=====Thermal Processing for Photolithography=====

*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
*[[Ovens 1, 2 & 3 (Labline)]]
*[[Oven 4 (Fisher)]]
*[[Oven 5 (Labline)]]
*[[High Temp Oven (Blue M)]]

=====Lithography Support=====


*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
===== Thermal Processing for Photolithography =====
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
* [[Ovens 1, 2 & 3 (Labline)]]
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
* [[Oven 4 (Fisher)]]
* [[Oven 5 (Labline)]]
* [[High Temp Oven (Blue M)]]
* [[Vacuum Oven (YES)]]
* The [https://www.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
|-
|-
|}
|}


= Vacuum Deposition =
=Vacuum Deposition=


{|
{|
|- valign="top"
|- valign="top"
| width="300" |
| width="300" |
===== Physical Vapor Deposition (PVD) =====
====Physical Vapor Deposition (PVD)====
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]


===== Sputter Deposition =====
=====Thermal Evaporation=====

*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[E-Beam 1 (Sharon)]]
*[[E-Beam 2 (Custom)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[E-Beam 5 (Plasys)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]

=====Sputter Deposition=====

*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (AJA ATC 2200-V)]]
*[[Sputter 5 (AJA ATC 2200-V)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[SEM Sample Coater (Hummer)]]


| width="400" |
| width="400" |
===== Chemical Vapor Deposition (CVD) =====
=====Chemical Vapor Deposition (CVD)=====

*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[PECVD 1 (PlasmaTherm 790)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[Molecular Vapor Deposition]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]


|}
|}


= Dry Etch =
=Dry Etch=


{|
{|
|- valign="top"
|- valign="top"
| width="300" |
| width="300" |
===== Reactive Ion Etching (RIE) =====
=====Reactive Ion Etching (RIE)=====
*[[RIE 2 (MRC)]]
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[Ashers (Technics PEII)]]
*[[Plasma Clean (Gasonics 2000)]]
*[[Plasma Activation (EVG 810)]]
*[[CAIBE (Oxford Ion Mill)]]


*[[RIE 2 (MRC)]]
===== Etch Monitoring =====
*[[RIE 5 (PlasmaTherm)]]
* [[Laser Etch Monitoring]] (Endpoint Detection)

* Optical Emission Spectra
=====Plasma Etching and Cleaning=====
* Residual Gas Analyzer (RGA)

*[[Plasma Clean (YES EcoClean)]]
*[[Plasma Activation (EVG 810)]]
*[[Ashers (Technics PEII)]]

=====Etch Monitoring=====

*[[Laser Etch Monitoring]] (Endpoint Detection)
*Optical Emission Spectra
*Residual Gas Analyzer (RGA)
| width="400" |
| width="400" |
===== ICP-RIE =====
=====ICP-RIE=====

*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP Etch 1 (Panasonic E646V)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[ICP Etch 2 (Panasonic E626I)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]

=====Ion Milling and Reactive Ion Beam Etching=====

*[[CAIBE (Oxford Ion Mill)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]

=====Other Dry Etching=====


*[[UV Ozone Reactor]]
===== Other Dry Etching =====
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
*[[UV Ozone Reactor]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
*[[Vapor HF Etch]]
*[[Vapor HF Etch]]


Line 98: Line 133:
|- valign="top"
|- valign="top"
| width="300" |
| width="300" |
* [[Wet Benches]]
*[[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[Toxic Corrosive Benches]]
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
**[[HF/TMAH Processing Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
**[[Plating Bench]]
| width="400" |
| width="400" |
* [[Gold Plating Bench]]
*[[Gold Plating Bench]]
* [[Critical Point Dryer]]
*[[Critical Point Dryer]]
* [[Spin Rinse Dryer (SemiTool)]]
*[[Spin Rinse Dryer (SemiTool)]]
* [[Chemical-Mechanical Polisher (Logitech)]]
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Mechanical Polisher (Allied)]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
|-
|-
|}
|}
Line 117: Line 156:
|- valign="top"
|- valign="top"
| width="400" |
| width="400" |
* [[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
*[[Rapid Thermal Processor (SSI Solaris 150)]]
* [[Strip Annealer]]
* [[High Temp Oven (Blue M)]]
*[[Tube Furnace (Tystar 8300)]]
* [[Tube Furnace (Tystar 8300)]]
*[[Tube Furnace Wafer Bonding (Thermco)]]
* [[Tube Furnace Wafer Bonding (Thermco)]]
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
*[[Wafer Bonder (SUSS SB6-8E)]]
* [[Tube Furnace AlGaAs Oxidation (Linberg)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
| width="400" |
| width="400" |
* [[Ovens 1, 2 & 3 (Labline)]]
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
* [[Oven 4 (Fisher)]]
**[[Ovens 1, 2 & 3 (Labline)]]
* [[Oven 5 (Labline)]]
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
* [[Vacuum Oven (YES)]]
**[[Oven 5 (Labline)]]
* [[Wafer Bonder (SUSS SB6-8E)]]
**[[High Temp Oven (Blue M)]]
* [[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
|-
|-
|}
|}


=Packaging=
=Packaging=
''Back-end Fabrication Tools''
* [[Dicing Saw (ADT)]]
{|
* [[Flip-Chip Bonder (Finetech)]]
|
* [[Vacuum Sealer]]
====Die Singulation / Down-sizing====
* [[Wire Saw (Takatori)]]


*[[Dicing Saw (ADT)]]
=Inspection, Test and Characterization=
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]

====Other Packaging====

*[[Vacuum Sealer]]
|
====Wafer/Die Bonding====

*[[Flip-Chip Bonder (Finetech)]]

*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
|}

=Measurement & Characterization=
''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
{|
{|
|- valign="top"
|- valign="top"
| width="300" |
| width="300" |
===== Optical/Electron Microscopy =====
=====Optical Microscopy=====
* [[Field Emission SEM 1 (FEI Sirion)]]
* [[Field Emission SEM 2 (JEOL 7600F)]]
* [[SEM Sample Coater (Hummer)]]
* [[Microscopes|Optical Microscopes]]
* [[Fluorescence Microscope (Olympus MX51)]]
* [[Deep UV Optical Microscope (Olympus)]]
* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Photo-emission & IR Microscope (QFI)]]


*[[Microscopes|Optical Microscopes]] - ''General Use''
===== Topographical Metrology =====
* [[Step Profilometer (KLA Tencor P-7)]]
*[[Fluorescence Microscope (Olympus MX51)]]
*[[Deep UV Optical Microscope (Olympus)]]
* [[Step Profilometer (Dektak 6M)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
* [[Atomic Force Microsope (Dimension 3100/Nanoscope IVA)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
* [[Surface Analysis (KLA/Tencor Surfscan)]]
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]
** ''Sub-micron Particle Counter''

* [[Laser Scanning Confocal M-scope (Olympus LEXT)]]
=====Electron Microscopy=====

*[[SEM 1 (JEOL IT800SHL)]]
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
*[[SEM Sample Coater (Hummer)]]

=====Topographical Metrology=====

*[[Step Profilometer (KLA Tencor P-7)]]
*[[Step Profilometer (DektakXT)]]
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
| width="400" |
| width="400" |
===== Thin-Film Analysis/Measurement =====
* [[Ellipsometer (Woollam)]]
* [[Film Stress (Tencor Flexus)]]
* [[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
* [[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
* [[Optical Film Thickness (Nanometric)]]
* [[Resistivity Mapper (CDE RESMAP)]]


===== Other Tools =====
=====Thin-Film/Material Analysis=====

* [[Probe Station & Curve Tracer]]
======Thickness + Optical Constants======
* [[Goniometer]]

* [[Photoluminescence PL Setup (Custom)]]
*[[Ellipsometer (Woollam)]]
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]

======Electrical Analysis======

*[[Resistivity Mapper (CDE RESMAP)]]
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]

======Other Properties======

*[[Film Stress (Tencor Flexus)]]
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
*[[Photoluminescence PL Setup (Custom)]]
|-
|-
|}
|}

== [[Decomissioned Tools]] ==
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

Latest revision as of 22:28, 6 August 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties

Decomissioned Tools

Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=162169"