Difference between revisions of "Tool List"
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=====Photoresists and Lithography Chemicals===== |
=====Photoresists and Lithography Chemicals===== |
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− | *See the [https://wiki.nanotech.ucsb.edu/ |
+ | *See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page]. |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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=====Contact Aligners (Optical Exposure)===== |
=====Contact Aligners (Optical Exposure)===== |
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− | *[[Suss Aligners (SUSS MJB-3)]] |
+ | *[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]] |
⚫ | |||
*[[Contact Aligner (SUSS MA-6)]] |
*[[Contact Aligner (SUSS MA-6)]] |
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*[[DUV Flood Expose]] |
*[[DUV Flood Expose]] |
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*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
*[[E-Beam Lithography System (JEOL JBX-6300FS)]] |
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− | *[[ |
+ | *[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]] |
*[[Focused Ion-Beam Lithography (Raith Velion)]] |
*[[Focused Ion-Beam Lithography (Raith Velion)]] |
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*[[Maskless Aligner (Heidelberg MLA150)]] |
*[[Maskless Aligner (Heidelberg MLA150)]] |
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− | ===== |
+ | =====Other Patterning Systems===== |
+ | |||
− | *[[Nano-Imprint (Nanonex NX2000)]] |
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*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]] |
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| width="400" | |
| width="400" | |
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*[[Oven 5 (Labline)]] |
*[[Oven 5 (Labline)]] |
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*[[High Temp Oven (Blue M)]] |
*[[High Temp Oven (Blue M)]] |
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− | *[[Vacuum Oven (YES)]] |
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=====Lithography Support===== |
=====Lithography Support===== |
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− | *The [https://wiki.nanotech.ucsb.edu/ |
+ | *The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes. |
− | *[https://signupmonkey.ece.ucsb.edu/ |
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches |
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]] |
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|- valign="top" |
|- valign="top" |
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| width="300" | |
| width="300" | |
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− | + | ====Physical Vapor Deposition (PVD)==== |
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+ | |||
+ | =====Thermal Evaporation===== |
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*[[E-Beam 1 (Sharon)]] |
*[[E-Beam 1 (Sharon)]] |
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*[[E-Beam 3 (Temescal)]] |
*[[E-Beam 3 (Temescal)]] |
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*[[E-Beam 4 (CHA)]] |
*[[E-Beam 4 (CHA)]] |
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+ | *[[E-Beam 5 (Plasys)]] |
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*[[Thermal Evap 1]] |
*[[Thermal Evap 1]] |
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*[[Thermal Evap 2 (Solder)]] |
*[[Thermal Evap 2 (Solder)]] |
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*[[Sputter 5 (AJA ATC 2200-V)]] |
*[[Sputter 5 (AJA ATC 2200-V)]] |
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*[[Ion Beam Deposition (Veeco NEXUS)]] |
*[[Ion Beam Deposition (Veeco NEXUS)]] |
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+ | *[[SEM Sample Coater (Hummer)]] |
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| width="400" | |
| width="400" | |
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=====Plasma Etching and Cleaning===== |
=====Plasma Etching and Cleaning===== |
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− | *[[Plasma Clean (Gasonics 2000)]] |
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*[[Plasma Clean (YES EcoClean)]] |
*[[Plasma Clean (YES EcoClean)]] |
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*[[Plasma Activation (EVG 810)]] |
*[[Plasma Activation (EVG 810)]] |
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=====ICP-RIE===== |
=====ICP-RIE===== |
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− | *[[ICP Etch 1 (Panasonic |
+ | *[[ICP Etch 1 (Panasonic E646V)]] |
− | *[[ICP Etch 2 (Panasonic |
+ | *[[ICP Etch 2 (Panasonic E626I)]] |
*[[ICP-Etch (Unaxis VLR)]] |
*[[ICP-Etch (Unaxis VLR)]] |
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+ | *[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]] |
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*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]] |
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*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]] |
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*[[CAIBE (Oxford Ion Mill)]] |
*[[CAIBE (Oxford Ion Mill)]] |
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+ | *[[Focused Ion-Beam Lithography (Raith Velion)]] |
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=====Other Dry Etching===== |
=====Other Dry Etching===== |
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**[[Develop Benches]] |
**[[Develop Benches]] |
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**[[Toxic Corrosive Benches]] |
**[[Toxic Corrosive Benches]] |
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+ | **[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]] |
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**[[HF/TMAH Processing Benches]] |
**[[HF/TMAH Processing Benches]] |
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**[[Plating Bench]] |
**[[Plating Bench]] |
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*[[Spin Rinse Dryer (SemiTool)]] |
*[[Spin Rinse Dryer (SemiTool)]] |
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*[[Chemical-Mechanical Polisher (Logitech)]] |
*[[Chemical-Mechanical Polisher (Logitech)]] |
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+ | *[[Mechanical Polisher (Allied)]] |
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*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]] |
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− | *[https://signupmonkey.ece.ucsb.edu/ |
+ | *[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)] |
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**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
**[[Oven 4 (Thermo-Fisher HeraTherm)]] |
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**[[Oven 5 (Labline)]] |
**[[Oven 5 (Labline)]] |
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− | **[[Vacuum Oven (YES)]] |
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**[[High Temp Oven (Blue M)]] |
**[[High Temp Oven (Blue M)]] |
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|- |
|- |
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|} |
|} |
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=Packaging= |
=Packaging= |
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+ | ''Back-end Fabrication Tools'' |
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+ | {| |
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⚫ | |||
+ | ====Die Singulation / Down-sizing==== |
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*[[Dicing Saw (ADT)]] |
*[[Dicing Saw (ADT)]] |
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+ | *[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]] |
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⚫ | |||
+ | *[[Automated Wafer Cleaver (Loomis LSD-155LT)]] |
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+ | |||
+ | ====Other Packaging==== |
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+ | |||
*[[Vacuum Sealer]] |
*[[Vacuum Sealer]] |
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⚫ | |||
− | *[[Wire Saw (Takatori)]] |
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+ | ====Wafer/Die Bonding==== |
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⚫ | |||
⚫ | |||
+ | |||
⚫ | |||
+ | *[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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+ | |||
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+ | ''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools'' |
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{| |
{| |
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|- valign="top" |
|- valign="top" |
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=====Optical Microscopy===== |
=====Optical Microscopy===== |
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− | *[[Microscopes|Optical Microscopes]] |
+ | *[[Microscopes|Optical Microscopes]] - ''General Use'' |
*[[Fluorescence Microscope (Olympus MX51)]] |
*[[Fluorescence Microscope (Olympus MX51)]] |
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*[[Deep UV Optical Microscope (Olympus)]] |
*[[Deep UV Optical Microscope (Olympus)]] |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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− | *[[ |
+ | *[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]] |
+ | *[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]] |
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+ | |||
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⚫ | |||
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− | *[[Field Emission SEM |
+ | *[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]] |
⚫ | |||
*[[SEM Sample Coater (Hummer)]] |
*[[SEM Sample Coater (Hummer)]] |
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*[[Step Profilometer (KLA Tencor P-7)]] |
*[[Step Profilometer (KLA Tencor P-7)]] |
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− | *[[Step Profilometer ( |
+ | *[[Step Profilometer (DektakXT)]] |
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]] |
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⚫ | |||
− | **''Sub-micron Particle Counter'' |
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*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]] |
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| width="400" | |
| width="400" | |
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+ | |||
=====Thin-Film/Material Analysis===== |
=====Thin-Film/Material Analysis===== |
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− | ====== |
+ | ======Thickness + Optical Constants====== |
+ | |||
*[[Ellipsometer (Woollam)]] |
*[[Ellipsometer (Woollam)]] |
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− | *[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]] |
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*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]] |
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− | *[[Optical Film Thickness (Nanometric)]] |
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*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]] |
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*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]] |
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− | ====== |
+ | ======Electrical Analysis====== |
⚫ | |||
⚫ | |||
− | ====== Electrical Analysis ====== |
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*[[Resistivity Mapper (CDE RESMAP)]] |
*[[Resistivity Mapper (CDE RESMAP)]] |
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− | *[[Probe Station & Curve Tracer]] |
+ | *[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]] |
+ | *[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]] |
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− | =====Other |
+ | ======Other Properties====== |
⚫ | |||
− | *[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]] |
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⚫ | |||
− | **''Surface hydrophobicity'' |
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|- |
|- |
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|} |
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− | |||
− | {{Special:Whatlinkshere}} |
Latest revision as of 11:52, 1 March 2024
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
Optical Microscopy
Electron MicroscopyTopographical Metrology |
Thin-Film/Material AnalysisThickness + Optical Constants
Electrical Analysis
Other Properties |