Tool List: Difference between revisions

From UCSB Nanofab Wiki
Jump to navigation Jump to search
No edit summary
(Made a "Decomissioned tools" section)
 
(40 intermediate revisions by 7 users not shown)
Line 7: Line 7:
=====Photoresists and Lithography Chemicals=====
=====Photoresists and Lithography Chemicals=====


*See the [https://wiki.nanotech.ucsb.edu/wiki/index.php/Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]


=====Contact Aligners (Optical Exposure)=====
=====Contact Aligners (Optical Exposure)=====


*[[Suss Aligners (SUSS MJB-3)]]
*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
⚫
*[[IR Aligner (SUSS MJB-3 IR)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[DUV Flood Expose]]
*[[DUV Flood Expose]]
Line 20: Line 19:


*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[Field Emission SEM 1 (FEI Sirion)|E-Beam Lithography (FEI Sirion Nabity v9)]]
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Maskless Aligner (Heidelberg MLA150)]]
*[[Maskless Aligner (Heidelberg MLA150)]]


===== Other Patterning Systems =====
=====Other Patterning Systems=====

*[[Nano-Imprint (Nanonex NX2000)]]
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
| width="400" |
| width="400" |
Line 41: Line 40:
*[[Oven 5 (Labline)]]
*[[Oven 5 (Labline)]]
*[[High Temp Oven (Blue M)]]
*[[High Temp Oven (Blue M)]]
*[[Vacuum Oven (YES)]]


=====Lithography Support=====
=====Lithography Support=====


*The [https://wiki.nanotech.ucsb.edu/wiki/index.php/Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
|-
|-
Line 56: Line 54:
|- valign="top"
|- valign="top"
| width="300" |
| width="300" |
=====Physical Vapor Deposition (PVD)=====
====Physical Vapor Deposition (PVD)====

=====Thermal Evaporation=====


*[[E-Beam 1 (Sharon)]]
*[[E-Beam 1 (Sharon)]]
Line 62: Line 62:
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 3 (Temescal)]]
*[[E-Beam 4 (CHA)]]
*[[E-Beam 4 (CHA)]]
⚫
*[[E-Beam 5 (Plasys)]]
*[[Thermal Evap 1]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
*[[Thermal Evap 2 (Solder)]]
Line 71: Line 72:
*[[Sputter 5 (AJA ATC 2200-V)]]
*[[Sputter 5 (AJA ATC 2200-V)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[SEM Sample Coater (Hummer)]]


| width="400" |
| width="400" |
Line 91: Line 93:


*[[RIE 2 (MRC)]]
*[[RIE 2 (MRC)]]
⚫
*[[RIE 3 (MRC)]]
*[[RIE 5 (PlasmaTherm)]]
*[[RIE 5 (PlasmaTherm)]]


=====Plasma Etching and Cleaning=====
=====Plasma Etching and Cleaning=====


*[[Plasma Clean (Gasonics 2000)]]
*[[Plasma Clean (YES EcoClean)]]
*[[Plasma Clean (YES EcoClean)]]
*[[Plasma Activation (EVG 810)]]
*[[Plasma Activation (EVG 810)]]
Line 109: Line 109:
=====ICP-RIE=====
=====ICP-RIE=====


*[[ICP Etch 1 (Panasonic E626I)]]
*[[ICP Etch 1 (Panasonic E646V)]]
*[[ICP Etch 2 (Panasonic E640)]]
*[[ICP Etch 2 (Panasonic E626I)]]
*[[ICP-Etch (Unaxis VLR)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Plasma-Therm SLR: Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]


Line 118: Line 118:


*[[CAIBE (Oxford Ion Mill)]]
*[[CAIBE (Oxford Ion Mill)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]


=====Other Dry Etching=====
=====Other Dry Etching=====
Line 137: Line 138:
**[[Develop Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[Toxic Corrosive Benches]]
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
**[[HF/TMAH Processing Benches]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
**[[Plating Bench]]
Line 144: Line 146:
*[[Spin Rinse Dryer (SemiTool)]]
*[[Spin Rinse Dryer (SemiTool)]]
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Mechanical Polisher (Allied)]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[https://signupmonkey.ece.ucsb.edu/wiki/index.php/Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
|-
|-
|}
|}
Line 165: Line 168:
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
**[[Oven 5 (Labline)]]
**[[Oven 5 (Labline)]]
**[[Vacuum Oven (YES)]]
**[[High Temp Oven (Blue M)]]
**[[High Temp Oven (Blue M)]]
⚫
|
|-
|-
|}
|}


=Packaging=
=Packaging=
''Back-end Fabrication Tools''
{|
⚫
|
====Die Singulation / Down-sizing====


*[[Dicing Saw (ADT)]]
*[[Dicing Saw (ADT)]]
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
⚫
*[[Flip-Chip Bonder (Finetech)]]
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]

====Other Packaging====

*[[Vacuum Sealer]]
*[[Vacuum Sealer]]
⚫
|
*[[Wire Saw (Takatori)]]
====Wafer/Die Bonding====

⚫
*[[Flip-Chip Bonder (Finetech)]]

⚫
*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
⚫
|}


=Inspection, Test and Characterization=
=Measurement & Characterization=
''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
{|
{|
|- valign="top"
|- valign="top"
Line 184: Line 201:
=====Optical Microscopy=====
=====Optical Microscopy=====


*[[Microscopes|Optical Microscopes]]
*[[Microscopes|Optical Microscopes]] - ''General Use''
*[[Fluorescence Microscope (Olympus MX51)]]
*[[Fluorescence Microscope (Olympus MX51)]]
*[[Deep UV Optical Microscope (Olympus)]]
*[[Deep UV Optical Microscope (Olympus)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Photo-emission & IR Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]

⚫
=====Electron Microscopy=====


⚫
*[[SEM 1 (JEOL IT800SHL)]]
⚫
===== Electron Microscopy =====
*[[Field Emission SEM 1 (FEI Sirion)]]
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
⚫
*[[Field Emission SEM 2 (JEOL 7600F)]]
*[[SEM Sample Coater (Hummer)]]
*[[SEM Sample Coater (Hummer)]]


Line 198: Line 217:


*[[Step Profilometer (KLA Tencor P-7)]]
*[[Step Profilometer (KLA Tencor P-7)]]
*[[Step Profilometer (Dektak 6M)]]
*[[Step Profilometer (DektakXT)]]
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
⚫
*[[Surface Analysis (KLA/Tencor Surfscan)]]
**''Sub-micron Particle Counter''
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
| width="400" |
| width="400" |

=====Thin-Film/Material Analysis=====
=====Thin-Film/Material Analysis=====


====== Thickness + Optical Constants ======
======Thickness + Optical Constants======

*[[Ellipsometer (Woollam)]]
*[[Ellipsometer (Woollam)]]
*[[Optical Film Thickness (Filmetrics)|Optical Film Thickness (Filmetrics F20)]]
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
*[[Optical Film Thickness (Nanometric)]]
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]


====== Other Properties ======
======Electrical Analysis======
⚫
*[[Film Stress (Tencor Flexus)]]
⚫
*[[Photoluminescence PL Setup (Custom)]]


====== Electrical Analysis ======
*[[Resistivity Mapper (CDE RESMAP)]]
*[[Resistivity Mapper (CDE RESMAP)]]
*[[Probe Station & Curve Tracer]]
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]


=====Other Tools=====
======Other Properties======


⚫
*[[Film Stress (Tencor Flexus)]]
*[[Goniometer (Rame-Hart A-100)|Goniometer (Ramé-Hart A-100)]]
⚫
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
**''Surface hydrophobicity''
⚫
*[[Photoluminescence PL Setup (Custom)]]
⚫
|-
⚫
|
⚫
|
|-
|-
|}
|}


== [[Decomissioned Tools]] ==
=Test=
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

Latest revision as of 22:28, 6 August 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties

Decomissioned Tools

Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

Retrieved from "https://wiki.nanofab.ucsb.edu/w/index.php?title=Tool_List&oldid=162169"