Tool List: Difference between revisions

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(Created page with "__NOTOC__ =Lithography= * Suss Aligners * IR Aligner * DUV Flood Expose * Ovens * Stepper 1 * Stepper 2 * Stepper 3 * E-Beam Lithography System =…")
 
(Made a "Decomissioned tools" section)
 
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__NOTOC__
__NOTOC__
=Lithography=
=Lithography=

* [[Suss Aligners]]
{|
* [[IR Aligner]]
|- valign="top"
* [[DUV Flood Expose]]
| width="300" |
* [[Ovens]]
=====Photoresists and Lithography Chemicals=====
* [[Stepper 1]]

* [[Stepper 2]]
*See the [https://wiki.nanotech.ucsb.edu/w/index.php?title=Lithography_Recipes#Chemicals_Stocked_.2B_Datasheets Chemical Datasheets page].
* [[Stepper 3]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
* [[E-Beam Lithography System]]

=====Contact Aligners (Optical Exposure)=====

*[[Suss Aligners (SUSS MJB-3)|Contact Aligners (SUSS MJB-3)]]
*[[Contact Aligner (SUSS MA-6)]]
*[[DUV Flood Expose]]

=====Direct-Write Lithography=====

*[[E-Beam Lithography System (JEOL JBX-6300FS)]]
*[[SEM 1 (JEOL IT800SHL)|E-Beam Lithography (Nabity v9)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]
*[[Maskless Aligner (Heidelberg MLA150)]]

=====Other Patterning Systems=====

*[[Holographic Lith/PL Setup (Custom)|Holographic Litho/PL Setup (Custom)]]
| width="400" |
=====Steppers (Optical Exposure)=====

*[[Stepper 1 (GCA 6300)|Stepper 1 (GCA 6300, i-line)]]
*[[Stepper 2 (AutoStep 200)|Stepper 2 (AutoStep 200, i-line)]]
*[[Stepper 3 (ASML DUV)|Stepper 3 (ASML DUV, Deep-UV)]]

=====Thermal Processing for Photolithography=====

*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all lab ovens]]
*[[Ovens 1, 2 & 3 (Labline)]]
*[[Oven 4 (Fisher)]]
*[[Oven 5 (Labline)]]
*[[High Temp Oven (Blue M)]]

=====Lithography Support=====

*The [https://wiki.nanotech.ucsb.edu/w/index.php?title=Wet_Benches#Spin_Coat_Benches Spinner Benches] have pre-set hotplates at various temperatures appropriate for common photoresist bakes.
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 POLOS spinners] on Develop and Solvent benches
*[[Spin Rinse Dryer (SemiTool)|Spin/Rinse/Dryer]]
|-
|}


=Vacuum Deposition=
=Vacuum Deposition=

* [[E-Beam Evaporator 1]]
{|
* [[E-Beam Evaporator 2]]
|- valign="top"
* [[E-Beam Evaporator 3]]
| width="300" |
* [[E-Beam Evaporator 4]]
====Physical Vapor Deposition (PVD)====
* [[Sputter Tool 1]]

* [[Sputter Tool 2]]
=====Thermal Evaporation=====
* [[Sputter Tool 3]]

* [[Sputter Tool 4]]
* [[Sputter Tool 5]]
*[[E-Beam 1 (Sharon)]]
* [[PECVD 1]]
*[[E-Beam 2 (Custom)]]
* [[PECVD 2]]
*[[E-Beam 3 (Temescal)]]
* [[VLR PECVD]]
*[[E-Beam 4 (CHA)]]
* [[IBD]]
*[[E-Beam 5 (Plasys)]]
* [[Molecular Vapor Deposition]]
*[[Thermal Evap 1]]
*[[Thermal Evap 2 (Solder)]]
* [[Atomic Layer Deposision]]

=====Sputter Deposition=====

*[[Sputter 3 (AJA ATC 2000-F)]]
*[[Sputter 4 (AJA ATC 2200-V)]]
*[[Sputter 5 (AJA ATC 2200-V)]]
*[[Ion Beam Deposition (Veeco NEXUS)]]
*[[SEM Sample Coater (Hummer)]]

| width="400" |
=====Chemical Vapor Deposition (CVD)=====

*[[PECVD 1 (PlasmaTherm 790)]]
*[[PECVD 2 (Advanced Vacuum)]]
*[[ICP-PECVD (Unaxis VLR)]]
*[[Molecular Vapor Deposition]]
*[[Atomic Layer Deposision (Oxford FlexAL)|Atomic Layer Deposition (Oxford FlexAL)]]

|}


=Dry Etch=
=Dry Etch=

* [[RIE 1]]
{|
* [[RIE 2]]
|- valign="top"
* [[RIE 3]]
| width="300" |
* [[RIE 5]]
=====Reactive Ion Etching (RIE)=====
* [[Si Deep RIE]]

* [[Ashers]]
* [[VLR Etch]]
*[[RIE 2 (MRC)]]
* [[ICP Etch 1]]
*[[RIE 5 (PlasmaTherm)]]

* [[ICP Etch 2]]
=====Plasma Etching and Cleaning=====
* [[UV Ozone Reactor]]

* [[Plasma Clean]]
*[[Plasma Clean (YES EcoClean)]]
* [[XeF2 Etch]]
* [[Plasma Activation Tool]]
*[[Plasma Activation (EVG 810)]]
*[[Ashers (Technics PEII)]]

=====Etch Monitoring=====

*[[Laser Etch Monitoring]] (Endpoint Detection)
*Optical Emission Spectra
*Residual Gas Analyzer (RGA)
| width="400" |
=====ICP-RIE=====

*[[ICP Etch 1 (Panasonic E646V)]]
*[[ICP Etch 2 (Panasonic E626I)]]
*[[Oxford ICP Etcher (PlasmaPro 100 Cobra)]]
*[[Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)|Fluorine ICP (PlasmaTherm/SLR Fluorine Etcher)]]
*[[DSEIII (PlasmaTherm/Deep Silicon Etcher)|Plasma-Therm DSE-iii (PlasmaTherm/Deep Silicon Etcher)]]

=====Ion Milling and Reactive Ion Beam Etching=====

*[[CAIBE (Oxford Ion Mill)]]
*[[Focused Ion-Beam Lithography (Raith Velion)]]

=====Other Dry Etching=====

*[[UV Ozone Reactor]]
*[[XeF2 Etch (Xetch)|XeF<sub>2</sub> Etch (Xetch)]]
*[[Vapor HF Etch]]

|}


=Wet Processing=
=Wet Processing=
See the [[Chemical List|Chemical List page]] for stocked chemicals such as Developers, Etchants, Solvents etc.
* [[Wet Benches]]
{|
* [[Gold Plating Bench]]
|- valign="top"
* [[Critical Point Dryer]]
| width="300" |
* [[Spin Rinse Dryer]]
*[[Wet Benches]]
**[[Solvent Cleaning Benches]]
**[[Spin Coat Benches]]
**[[Develop Benches]]
**[[Toxic Corrosive Benches]]
**[[Wet Benches#Wafer Toxic Corrosive Benches|Wafer Toxic Corrosive Bench]]
**[[HF/TMAH Processing Benches]]
**[[Plating Bench]]
| width="400" |
*[[Gold Plating Bench]]
*[[Critical Point Dryer]]
*[[Spin Rinse Dryer (SemiTool)]]
*[[Chemical-Mechanical Polisher (Logitech)]]
*[[Mechanical Polisher (Allied)]]
*[[Automated Coat/Develop System (S-Cubed Flexi)|Auto. Coat/Develop (S-Cubed Flexi)]]
*[https://signupmonkey.ece.ucsb.edu/w/index.php?title=Wet_Benches#Automated_Wet-processing_Spinners_.28POLOS.29 Auto. Wet-Processing Spinners (POLOS)]
|-
|}


=Thermal Processing=
=Thermal Processing=
{|
* [[Wet Benches]]
|- valign="top"
* [[Gold Plating Bench]]
| width="400" |
* [[Critical Point Dryer]]
*[[Rapid Thermal Processor (AET RX6)|Rapid Thermal Annealer/Processor "RTA" (AET RX6)]]
* [[Spin Rinse Dryer]]
*[[Rapid Thermal Processor (SSI Solaris 150)]]
*[[Tube Furnace (Tystar 8300)]]
*[[Tube Furnace Wafer Bonding (Thermco)]]
*[[Tube Furnace AlGaAs Oxidation (Lindberg)]]
*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
| width="400" |
*[[Ovens - Overview of All Lab Ovens|Ovens - Overview of all Lab Ovens]]
**[[Ovens 1, 2 & 3 (Labline)]]
**[[Oven 4 (Thermo-Fisher HeraTherm)]]
**[[Oven 5 (Labline)]]
**[[High Temp Oven (Blue M)]]
|-
|}


=Packaging=
=Packaging=
''Back-end Fabrication Tools''
* [[Flip-Chip Bonder]]
{|
* [[Vacuum Sealer]]
|
* [[Dicing Saw]]
====Die Singulation / Down-sizing====

*[[Dicing Saw (ADT)]]
*[[Wafer Cleaver (PELCO Flip-Scribe)|Manual Wafer Cleaver (PELCO Flipscribe)]]
*[[Automated Wafer Cleaver (Loomis LSD-155LT)]]

====Other Packaging====

*[[Vacuum Sealer]]
|
====Wafer/Die Bonding====

*[[Flip-Chip Bonder (Finetech)]]

*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
|}

=Measurement & Characterization=
''[https://en.wikipedia.org/wiki/Metrology Metrology], Electrical/Optical Testing and Thin-Film/Materials [https://en.wikipedia.org/wiki/Characterization_(materials_science) Characterization] tools''
{|
|- valign="top"
| width="300" |
=====Optical Microscopy=====

*[[Microscopes|Optical Microscopes]] - ''General Use''
*[[Fluorescence Microscope (Olympus MX51)]]
*[[Deep UV Optical Microscope (Olympus)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
*[[Digital Microscope (Olympus DSX1000)|Digital Microscope #7 (Olympus DSX1000)]]
*[[Suss Aligners (SUSS MJB-3)#Backside Alignment|Near-IR Inspection Scope (MJB-IR)]]

=====Electron Microscopy=====

*[[SEM 1 (JEOL IT800SHL)]]
*[[Field Emission SEM 2 (JEOL IT800SHL)|SEM 2 (JEOL IT800SHL) w/ EDAX]]
*[[SEM Sample Coater (Hummer)]]

=====Topographical Metrology=====

*[[Step Profilometer (KLA Tencor P-7)]]
*[[Step Profilometer (DektakXT)]]
*[[Atomic Force Microscope (Bruker ICON)|Atomic Force Microsope (Bruker ICON)]]
*[[Laser Scanning Confocal M-scope (Olympus LEXT)]]
| width="400" |

=====Thin-Film/Material Analysis=====

======Thickness + Optical Constants======

*[[Ellipsometer (Woollam)]]
*[[Filmetrics F40-UV Microscope-Mounted|Optical Film Thickness (Microscope-Mounted Filmetrics F-40-UV)]]
*[[Optical Film Thickness & Wafer-Mapping (Filmetrics F50)]]
*[[Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)|Reflection/Transmission Spectra & Optical Film Thickness (Filmetrics F10-RT-UVX)]]

======Electrical Analysis======

*[[Resistivity Mapper (CDE RESMAP)]]
*[[Probe Station & Curve Tracer|Probe Station & Source/Meter Units]]
*[[IR Thermal Microscope (QFI)|Photo-emission & Thermal IR Microscope (QFI)]]

======Other Properties======

*[[Film Stress (Tencor Flexus)]]
*[[Surface Analysis (KLA/Tencor Surfscan)|Particle Counts (KLA/Tencor Surfscan)]]
*[[Photoluminescence PL Setup (Custom)]]
|-
|}


== [[Decomissioned Tools]] ==
=Inspection, Test and Characterization=
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.
* [[Field Emission SEM 1]]
* [[Field Emission SEM 2]]
* [[Step Profile]]
* [[Step Profilometer]]
* [[Ellipsometer]]
* [[Microscopes]]
* [[Probe Station & Curve Tracer]]
* [[Optical Film Thickness (Filmetrics)]]
* [[Scanning Probe Microscope]]
* [[Tencor Flexus Film Stress]]
* [[Optical Film Thickness (Nanometric)]]
* [[SEM Sample Coater]]
* [[Surface Analysis]]
* [[Photo-emission & IR Microscope]]
* [[Ellipsometer (Woollam)]]
* [[Goniometer]]
* [[4-Point Probe Resistivity Mapper]]

Latest revision as of 22:28, 6 August 2024

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Optical Microscopy
Electron Microscopy
Topographical Metrology
Thin-Film/Material Analysis
Thickness + Optical Constants
Electrical Analysis
Other Properties

Decomissioned Tools

Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.

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