Tool List: Difference between revisions

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*[[Flip-Chip Bonder (Finetech)]]
*[[Flip-Chip Bonder (Finetech)]]

*[[Wafer Bonder (SUSS SB6-8E)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]]
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Revision as of 22:58, 10 November 2026

Tool Categories

Lithography

Photoresists and Lithography Chemicals
Contact Aligners (Optical Exposure)
Direct-Write Lithography
Other Patterning Systems
Steppers (Optical Exposure)
Thermal Processing for Photolithography
Lithography Support

Vacuum Deposition

Physical Vapor Deposition (PVD)

Thermal Evaporation
Sputter Deposition
Chemical Vapor Deposition (CVD)

Dry Etch

Reactive Ion Etching (RIE)
Plasma Etching and Cleaning
Etch Monitoring
ICP-RIE
Ion Milling and Reactive Ion Beam Etching
Other Dry Etching

Wet Processing

See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.

Thermal Processing

Packaging

Back-end Fabrication Tools

Die Singulation / Down-sizing

Other Packaging

Wafer/Die Bonding

Measurement & Characterization

Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools

Inspection

Microscopes 🔬
Electron Microscopes 🦠
Topology / Profilometer 🏔️

Thin-Film/Material Analysis

Optical 🔦
Electrical ⚡️
Other 🔍

Decomissioned Tools

Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.