Tool List: Difference between revisions
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*[[Flip-Chip Bonder (Finetech)]] |
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*[[Wafer Bonder (SUSS SB6-8E)]] |
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*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
*[[Wafer Bonder (Logitech WBS7)|Wafer Bonder/Wax Mounting (Logitech WBS2)]] |
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Revision as of 22:58, 10 November 2026
Tool Categories |
Lithography
Photoresists and Lithography ChemicalsContact Aligners (Optical Exposure)Direct-Write Lithography
Other Patterning Systems |
Steppers (Optical Exposure)Thermal Processing for Photolithography
Lithography Support
|
Vacuum Deposition
Physical Vapor Deposition (PVD)Thermal Evaporation
Sputter Deposition |
Chemical Vapor Deposition (CVD) |
Dry Etch
Reactive Ion Etching (RIE)Plasma Etching and CleaningEtch Monitoring
|
ICP-RIE
Ion Milling and Reactive Ion Beam EtchingOther Dry Etching |
Wet Processing
See the Chemical List page for stocked chemicals such as Developers, Etchants, Solvents etc.
Thermal Processing
Packaging
Back-end Fabrication Tools
Die Singulation / Down-sizingOther Packaging |
Wafer/Die Bonding |
Measurement & Characterization
Metrology, Electrical/Optical Testing and Thin-Film/Materials Characterization tools
InspectionMicroscopes 🔬
Electron Microscopes 🦠Topology / Profilometer 🏔️ |
Thin-Film/Material AnalysisOptical 🔦
Electrical ⚡️
Other 🔍 |
Decomissioned Tools
Click the link above for a list of tools that are no longer available in the lab, but the data is retained for legacy purposes.