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- E-BEAM
- E-Beam 1
- E-Beam 1 (Sharon)
- E-Beam 2
- E-Beam 2 (Custom)
- E-Beam 3
- E-Beam 3 (Temescal)
- E-Beam 4
- E-Beam 4 (CHA)
- E-Beam 5 (Plasys)
- E-Beam Evaporation Recipes
- E-Beam Evaporator 1
- E-Beam Evaporator 3
- E-Beam Lithography Recipes
- E-Beam Lithography System (JEOL JBX-6300FS)
- Editing Tutorials
- Electronics Presentations
- Ellipsometer (Rudolph)
- Ellipsometer (Woollam)
- Ellipsometer (Woollam) - Measuring thin dielectrics with Native Oxide pre-measurement
- Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement
- Equipment Group - Video Training Procedures
- Errors
- Exposing a wafer piece
- FAQs
- FIJI - Microscope Measurement Tools
- Field Emission SEM 2 (JEOL 7600F)
- Field Emission SEM 2 (JEOL IT800SHL)
- Film Stress (Tencor Flexus)
- Filmetrics F10-RT-UVX Operating Procedure
- Filmetrics F40-UV Microscope-Mounted
- Filmetrics F40-UV Quick Start
- Filmetrics F50 - Operating Procedure
- Flip-Chip Bonder
- Flip-Chip Bonder (Finetech)
- Flood Exposure Recipes
- Fluorescence Microscope (Olympus MX51)
- Fluorine ICP Etcher (PlasmaTherm/SLR Fluorine ICP)
- Focused Ion-Beam Lithography (Raith Velion)
- Foong Fatt
- Frequently Asked Questions
- GCA 6300 Mask Making Guidance
- GCA 6300 Reboot Procedures
- GCA 6300 USer Accessible Commands
- GCA 6300 training manual -old instructions
- GCA Old full training manual
- Glossary
- GoPro Hero8 Black (Internal)
- Gold Plating Bench
- Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.
- Goniometer
- Goniometer (Rame-Hart A-100) - Operating Procedure
- Gopikrishnan G M
- HF/TMAH Processing Bench
- HF/TMAH Processing Benches
- HF Processing Bench
- HF Vapor Etch
- High Temp Oven (Blue M)
- Holographic Lith/PL Setup
- Holographic Lith/PL Setup (Custom)
- Homepage Draft1
- Hummer SEM Sample Coater - Techniques to reduce charging in SEMs
- IBD: Calibrating Optical Thickness
- ICP-Etch (Unaxis VLR)
- ICP-PECVD (Unaxis VLR)
- ICP Etch 1 (Panasonic E626I)
- ICP Etch 1 (Panasonic E646V)
- ICP Etch 2 (Panasonic E626I)
- ICP Etch 2 (Panasonic E640)
- ICP Etching Recipes
- IR Aligner (SUSS MJB-3 IR)
- IR Thermal Microscope (QFI)
- InP Etch Rate and Selectivity (InP/SiO2)
- InP Etch Test-in details
- InP Etch Test Result in Details
- InP Etch test -details
- InP etch result in details
- Inspection, Test and Characterization
- Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers
- Intellemetrics Laser Etch Monitor Procedure for Plasma-Therm Etchers
- Ion Beam Deposition (Veeco NEXUS)
- JEOL IT800SHL - Reduced Charging Imaging Modes
- Jack Whaley
- KLA Tencor P7 - Basic profile instructions
- KLA Tencor P7 - Saving Profile Data
- KLayout Design Tips
- Lab Rules
- Lab Rules OLD 2018
- Lab Rules backup
- Laser Etch Monitor Simulation in Python
- Laser Etch Monitoring
- Laser Scanning Confocal M-scope (Olympus LEXT)
- Lee Sawyer
- LegacyTable
- Lift-Off with DUV Imaging + PMGI Underlayer
- Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer
- Lithography
- Lithography Calibration - Analyzing a Focus-Exposure Matrix
- Lithography Chemicals
- Lithography Recipes
- Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond
- Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick
- Luis Zuzunaga
- MA6 Backside Alignment - Allowed Mark Locations
- MLA150 - CAD Files and Templates
- MLA150 - Design Guidelines
- MLA150 - Focus-Exposure Matrix ("Series" mode)
- MLA150 - Large Image GDS Generation
- MLA150 - Troubleshooting
- MLA Recipes
- MSDS
- MVD - Wafer Coating - Process Traveler
- Main Page
- Main Page mod
- Mask Making Guidelines for Contact Aligners
- Maskless Aligner (Heidelberg MLA150)
- Maskless Aligner Recipes
- Measurements and Imaging with Amscope Camera - Quickstart Usage Guide
- Mechanical Polisher (Allied)
- Michael Barreraz
- Microscopes
- Mike Day
- Mike Silva
- Molecular Vapor Deposition
- Molecular Vapor Deposition Recipes
- Nano-Imprint (Nanonex NX2000)
- NanoFab Process Group
- Nanofab-IT - Add Device to Network
- Nanofab Job Postings
- Nanofab New User Onboarding
- Nanofab Staff Internal Pages
- Nick test
- Ning Cao
- Noah Dutra
- OLD - PECVD2 Recipes
- Old Deposition Data - 2021-12-15
- Old Deposition Data - NastaziaM 2021-11-22
- Old Training Manual
- Old training manual
- Older Publications
- Olympus LEXT OLS4000 Confocal uScope - Quick Start
- Operating Instructions
- Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)
- Optical Film Thickness & Wafer-Mapping (Filmetrics F50)
- Optical Film Thickness (Filmetrics)
- Optical Film Thickness (Nanometric)
- Other Dry Etching Recipes
- Oven 4 (Fisher)
- Oven 4 (Thermo-Fisher HeraTherm)
- Oven 5 (Labline)
- Ovens - Overview of All Lab Ovens
- Ovens 1, 2 & 3 (Labline)
- Oxford Etcher - Sample Size Effect on Etch Rate
- Oxford ICP Etcher (PlasmaPro 100 Cobra)
- Oxford ICP Etcher - Process Control Data
- Oxygen Plasma System Recipes
- PECV1 Wafer Coating Process Traveler
- PECVD.docx
- PECVD1-(PlasmaTherm 790)
- PECVD1-SIN Standard Recipe (PlasmaTherm 790)
- PECVD1-SiN-standard recipe.pdf
- PECVD1-SiN standard recipe.pdf
- PECVD1 Operating Instructions.pdf
- PECVD1 Recipes
- PECVD1 Wafer Coating Process
- PECVD1 Wafer Coating Process Traveler
- PECVD 1
- PECVD 1 (PlasmTherm 790)
- PECVD 1 (PlasmaTherm 790)
- PECVD 2 (Advanced Vacuum)
- PECVD Recipes
- Packaging
- Packaging Recipes
- Peder Lenvik
- Photo-emission & IR Microscope (QFI)
- Photolithography - Improving Adhesion Photoresist Adhesion
- Photolithography - Manual Edge-Bead Removal Techniques
- Photoluminescence PL Setup (Custom)
- Photomask Ordering Procedure for UCSB Users
- Photonics Presentations
- Photoresist Spin Coat Benches
- Plasma Activation (EVG 810)
- Plasma Activation Tool (EVG 810)
- Plasma Clean (Gasonics 2000)
- Plasma Clean (YES EcoClean)
- Plating Bench
- Probe Station: I-V Curves with Keithley 2400 and Python Script
- Probe Station & Curve Tracer
- ProcessGroup: Shipping Samples on Dicing Tape+Frame
- Process Group - Billing Instructions
- Process Group - Lab Stocking/Supplies Tasks
- Process Group - Process Control Data
- Process Group - Remote Fabrication Jobs
- Process Group Interns
- Process Group Internships
- Processing - How Do I…?
- Programming a Job
- PubList2018
- Publications - 2013-2014
- RIE5 - Standard Operating procedure (Cortex Software)
- RIE 1
- RIE 1 (Custom)
- RIE 2
- RIE 2 (MRC)
- RIE 3
- RIE 3 (MRC)
- RIE 5
- RIE 5 (PlasmaTherm)
- RIE 5 (PlasmaTherm SLR)
- RIE Etching Recipes
- Rapid Thermal Processor (AET RX6)
- Rapid Thermal Processor (SSI Solaris 150)
- Research
- Resistivity Mapper (CDE RESMAP)
- S-Cubed Flexi - Operating Procedure
- SEM 1 (JEOL IT800SHL)
- SEM Sample Coater (Hummer)
- SPR220-7 at 3kW various temperature without N2 gas
- STD SiO2 recipe
- Services
- SiN 100C Table-2019
- SiO2 Etching Test using CF4/CHF3
- Si Deep RIE
- Si Deep RIE (Bosch Etch)
- Silicon Deep Etcher (Plasma-Therm SLR)
- Solvent Benches
- Solvent Cleaning Benches
- Spin Coat Benches
- Spin Rinse Dryer (SemiTool)
- Sputter 1 (Custom)
- Sputter 2 (SFI Endeavor)
- Sputter 3 (AJA ATC 2000-F)
- Sputter 3 (ATC 2000-F)
- Sputter 4 (AJA ATC 2200-V)
- Sputter 4 (ATC 2200-V)
- Sputter 5
- Sputter 5 (AJA ATC 2200-V)
- Sputter 5 (Lesker AXXIS)
- Sputtering Recipes
- Staff List
- Staff Notes
- Step Profilometer (DektakXT)
- Step Profilometer (Dektak 6M)
- Step Profilometer (KLA Tencor P-7)
- Stepper 1
- Stepper 1 (GCA6300) How to select proper chuck
- Stepper 1 (GCA 6300)
- Stepper 1 (GCA 6300) - Standard Operating Procedure
- Stepper 1 (GCA 6300) Available chucks
- Stepper 1 (GCA 6300) Substrate Thickness, Shim Thickness ans Target Thickness
- Stepper 2
- Stepper 2 (AutoStep 200)
- Stepper 2 (AutoStep 200) - Operating Procedure - Piece Parts
- Stepper 2 (AutoStep 200) Operating Procedures
- Stepper 2 (Autostep 200) - Chuck Selection
- Stepper 2 (Autostep 200) - Job Programming
- Stepper 2 (Autostep 200) - Piece vs. Wafer Programming Differences
- Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses
- Stepper 3 (ASML)
- Stepper 3 (ASML DUV)
- Stepper Mask-Making Guidelines (Generic)
- Stepper Recipes
- Stocked Chemical List
- Strip Annealer
- Surface Analysis (KLA/Tencor Surfscan)
- Surfscan6200 photos
- Surfscan Errors and Workarounds
- Surfscan SOP for 4inch wafers
- Surfscan SOP for 6inch wafers
- Surfscan SOP for 8inch wafers
- Surfscan SOP for small substrates
- Surfscan photo
- Suss Aligners (SUSS MJB-3)
- Suss MA-6 Backside Alignment QuickStart
- TEST PAGE
- THz Physics Presentations
- Tech Talks Seminar Series
- Tencor Flexus Film Stress
- Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher
- Test Data of Etching SiO2 with CHF3/CF4-Fluorine ICP Etcher
- Test Data of etching SiO2 with CHF3/CF4
- Test Data of etching SiO2 with CHF3/CF4-Florine
- Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher
- Test Data of etching SiO2 with CHF3/CF4-ICP1
- Test Data of etching SiO2 with CHF3/CF4/O2
- Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)
- Test Page
- Thermal Evap 1
- Thermal Evap 2 (Solder)
- Thermal Evaporation Recipes
- Thermal Evaporator 1
- Thermal Evaporator 2
- Thermal Processing
- Thermal Processing Recipes
- Tino Sy
- Tom Reynolds
- Tony Bosch
- Tool List
- Toxic Corrosive Benches
- Troubleshooting and Recovery
- Tube Furnace (Tystar 8300)
- Tube Furnace AlGaAs Oxidation (Linberg)
- Tube Furnace AlGaAs Oxidation (Lindberg)
- Tube Furnace Wafer Bonding (Thermco)
- UCSBTEST1Gain4.jpg
- UCSB NanoFab Microscope Training
- UCSB NetID Login Troubleshooting
- UV Ozone Quick Start
- UV Ozone Reactor
- Unaxis SOP 3-12-2020.docx
- Unaxis SiN100C 300nm-2019
- Unaxis Test Recipe Page
- Unaxis VLR Etch - Process Control Data
- Unaxis VLR ICP-Etch
- Unaxis VLR ICP-PECVD
- Unaxis wafer coating procedure
- Usage Data and Statistics
- User Accessible Commands
- Vacuum Deposition
- Vacuum Deposition Recipes
- Vacuum Oven (YES)
- Vacuum Sealer
- Vapor HF Etch
- Vapor HF Etch (uETCH)
- Video Training: Hosting with Zoom and GacuhoCast/Panopto
- Video Training: Uploading to GauchoCast/Panopto (Internal)
- Video Training - Introduction (Internal)
- Vraj Mehalana
- Wafer Bonder (Logitech WBS7)
- Wafer Bonder (Logitech WSB7)
- Wafer Bonder (SUSS SB6-8E)
- Wafer Cleaver (PELCO Flip-Scribe)
- Wafer Cleaver Recipes (LSD-155LT)
- Wafer Coating Process Traveler
- Wafer Coating Process Traveler1
- Wafer Scanning/Coating Process Traveler ( combined/less detailed)
- Wafer Scanning process Traveler
- Wafer Toxic Corrosive Bench
- Wafer coating procedure
- Wafer scanning process traveler
- Wet Benches
- Wet Etching Recipes
- Wet Processing
- White-Light/Phase-Shift Interference Profilometer (Filmetrics Profilm3D)
- Wiki Admin
