Pages with the fewest revisions

Showing below up to 250 results in range #1 to #250.

1. Stepper 2 (AutoStep 200) - Operating Procedure - Piece Parts‏‎ (1 revision)
2. AUTOSTEP 200-PIECES 1st litho BL and BR orientation.pptx‏‎ (1 revision)
3. Surfscan Errors and Workarounds‏‎ (1 revision)
4. YES Recipe Screenshots: STD-O2‏‎ (1 revision)
5. Surfscan SOP for 6inch wafers‏‎ (1 revision)
6. PECVD.docx‏‎ (1 revision)
7. Operating Instructions‏‎ (1 revision)
8. Advanced PECVD Recipes‏‎ (1 revision)
9. PECVD1 Operating Instructions.pdf‏‎ (1 revision)
10. Wafer coating procedure‏‎ (1 revision)
11. LegacyTable‏‎ (1 revision)
12. Older Publications‏‎ (1 revision)
13. YES Recipe Screenshots: STD-N2-O2‏‎ (1 revision)
14. UCSBTEST1Gain4.jpg‏‎ (1 revision)
15. STD SiO2 recipe‏‎ (1 revision)
16. Comparison of ash rate for different gas mixtures, especially between O2 only vs O2/N2 mixture.‏‎ (1 revision)
17. UV Ozone Quick Start‏‎ (1 revision)
18. AUTOSTEP 200-PIECES instruction 6-20-19.pptx‏‎ (1 revision)
19. Filmetrics F50 - Operating Procedure‏‎ (1 revision)
20. RIE5 - Standard Operating procedure (Cortex Software)‏‎ (1 revision)
21. Unaxis SOP 3-12-2020.docx‏‎ (1 revision)
22. IR Thermal Microscope (QFI) - Standard Operating Procedure (HotSpot/ThermalEmission)‏‎ (1 revision)
23. MA6 Backside Alignment - Allowed Mark Locations‏‎ (1 revision)
24. ASML Stepper 3 - Substrates smaller than 100mm/4-inch‏‎ (1 revision)
25. Lab Rules backup‏‎ (1 revision)
26. PECVD1-SiN-standard recipe.pdf‏‎ (1 revision)
27. Surfscan SOP for 4inch wafers‏‎ (1 revision)
28. SiN 100C Table-2019‏‎ (1 revision)
29. Unaxis Test Recipe Page‏‎ (1 revision)
30. Stepper 1 (GCA6300) How to select proper chuck‏‎ (1 revision)
31. Oxford Etcher - Sample Size Effect on Etch Rate‏‎ (1 revision)
32. Surfscan SOP for 8inch wafers‏‎ (1 revision)
33. Video Training - Introduction (Internal)‏‎ (1 revision)
34. Sputter 5‏‎ (1 revision)
35. Flood Exposure Recipes‏‎ (1 revision)
36. ProcessGroup: Shipping Samples on Dicing Tape+Frame‏‎ (1 revision)
37. Surfscan SOP for small substrates‏‎ (1 revision)
38. Stepper 1 (GCA 6300) Available chucks‏‎ (1 revision)
39. Nanofab-IT - Add Device to Network‏‎ (1 revision)
40. Publications - 2013-2014‏‎ (1 revision)
41. Quarter First Layer Instructions‏‎ (1 revision)
42. Stepper 1 (GCA 6300) Substrate Thickness, Shim Thickness ans Target Thickness‏‎ (1 revision)
43. Ellipsometer (Woollam) - Measuring thin dielectrics with Native Oxide pre-measurement‏‎ (1 revision)
44. InP Etch test -details‏‎ (1 revision)
45. Intellemetrics Laser Etch Monitor Procedure for Plasma-Therm Etchers‏‎ (1 revision)
46. InP Etch Test-in details‏‎ (1 revision)
47. TEST PAGE‏‎ (1 revision)
48. Equipment Group - Video Training Procedures‏‎ (1 revision)
49. Silicon Deep Etcher (Plasma-Therm SLR)‏‎ (2 revisions)
50. CDE ResMap Quick-Start instructions‏‎ (2 revisions)
51. JEOL IT800SHL - Reduced Charging Imaging Modes‏‎ (2 revisions)
52. E-Beam 5 (Plasys)‏‎ (2 revisions)
53. UCSB NetID Login Troubleshooting‏‎ (2 revisions)
54. ASML 5500: Choose Marks for Prealignment‏‎ (2 revisions)
55. Stepper 2 (Autostep 200) - Chuck Selection‏‎ (2 revisions)
56. Test Data of etching SiO2 with CHF3/CF4/O2‏‎ (2 revisions)
57. ADT 7100 - Recovering an Old Recipe (2019)‏‎ (2 revisions)
58. Strip Annealer‏‎ (2 revisions)
59. Test Page‏‎ (2 revisions)
60. Molecular Vapor Deposition Recipes‏‎ (2 revisions)
61. PECVD1-SIN Standard Recipe (PlasmaTherm 790)‏‎ (2 revisions)
62. AZ5214 - Basic Process‏‎ (2 revisions)
63. THz Physics Presentations‏‎ (2 revisions)
64. E-Beam Lithography Recipes‏‎ (2 revisions)
65. GCA 6300 training manual -old instructions‏‎ (2 revisions)
66. Process Group - Lab Stocking/Supplies Tasks‏‎ (2 revisions)
67. Surfscan photo‏‎ (2 revisions)
68. Stepper 2 (Autostep 200) - Table of Chucks, Shims, Target Thicknesses‏‎ (2 revisions)
69. Wafer Cleaver Recipes (LSD-155LT)‏‎ (2 revisions)
70. Michael Barreraz‏‎ (2 revisions)
71. Thermal Evaporator 2‏‎ (2 revisions)
72. Plasma Clean (Gasonics 2000)‏‎ (2 revisions)
73. Exposing a wafer piece‏‎ (2 revisions)
74. SPR220-7 at 3kW various temperature without N2 gas‏‎ (2 revisions)
75. Video Training: Uploading to GauchoCast/Panopto (Internal)‏‎ (2 revisions)
76. ASML Stepper 3: Wafer Handler Reset Procedure‏‎ (2 revisions)
77. Unaxis SiN100C 300nm-2019‏‎ (2 revisions)
78. Main Page mod‏‎ (2 revisions)
79. Surfscan6200 photos‏‎ (2 revisions)
80. Autostep 200 Old training manual‏‎ (2 revisions)
81. Errors‏‎ (2 revisions)
82. SiO2 Etching Test using CF4/CHF3‏‎ (2 revisions)
83. Gopikrishnan G M‏‎ (3 revisions)
84. Hummer SEM Sample Coater - Techniques to reduce charging in SEMs‏‎ (3 revisions)
85. Nick test‏‎ (3 revisions)
86. Foong Fatt‏‎ (3 revisions)
87. Photomask Ordering Procedure for UCSB Users‏‎ (3 revisions)
88. Vapor HF Etch (uETCH)‏‎ (3 revisions)
89. Ellipsometer (Woollam) - Measuring thin metals with oxide pre-measurement‏‎ (3 revisions)
90. Vacuum Sealer‏‎ (3 revisions)
91. Decomissioned Tools‏‎ (3 revisions)
92. ADT UV-Tape Table 1042R‏‎ (3 revisions)
93. MVD - Wafer Coating - Process Traveler‏‎ (3 revisions)
94. ASML Stepper 3 Dicing Guide Programming‏‎ (3 revisions)
95. PECVD1-SiN standard recipe.pdf‏‎ (3 revisions)
96. Test Data of Etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (3 revisions)
97. Test Data of etching SiO2 with CHF3/CF4-Florine ICP Etcher‏‎ (3 revisions)
98. Nanofab New User Onboarding‏‎ (3 revisions)
99. Gold surface oxidation (darkening) due to O2/N2 plasma; the need for O2 only recipe.‏‎ (3 revisions)
100. DS-K101-304 Bake Temp. versus Develop Rate‏‎ (3 revisions)
101. Ellipsometer (Rudolph)‏‎ (3 revisions)
102. Sputter 1 (Custom)‏‎ (3 revisions)
103. Wire Saw (Takatori)‏‎ (3 revisions)
104. Video Training: Hosting with Zoom and GacuhoCast/Panopto‏‎ (3 revisions)
105. Mike Day‏‎ (3 revisions)
106. Vacuum Oven (YES)‏‎ (3 revisions)
107. E-Beam 1 - 4-inch, 4-wafer Fixture SOP‏‎ (3 revisions)
108. ASML 5500: Recovering from a Typo in Reticle ID‏‎ (3 revisions)
109. User Accessible Commands‏‎ (3 revisions)
110. Glossary‏‎ (3 revisions)
111. Test Data of etching SiO2 with CHF3/CF4-Florine‏‎ (4 revisions)
112. Jack Whaley‏‎ (4 revisions)
113. Photolithography - Improving Adhesion Photoresist Adhesion‏‎ (4 revisions)
114. KLA Tencor P7 - Basic profile instructions‏‎ (4 revisions)
115. Filmetrics F10-RT-UVX Operating Procedure‏‎ (4 revisions)
116. Peder Lenvik‏‎ (4 revisions)
117. Process Group Internships‏‎ (4 revisions)
118. Wafer Scanning process Traveler‏‎ (4 revisions)
119. Claudia Gutierrez‏‎ (4 revisions)
120. Logitech WBS7 - Procedure for Wax Mounting with Spin-On Crystalbond‏‎ (4 revisions)
121. Suss MA-6 Backside Alignment QuickStart‏‎ (4 revisions)
122. Electronics Presentations‏‎ (4 revisions)
123. Gold Plating Bench‏‎ (4 revisions)
124. Tube Furnace AlGaAs Oxidation (Lindberg)‏‎ (4 revisions)
125. MLA150 - Large Image GDS Generation‏‎ (4 revisions)
126. Laser Etch Monitor Simulation in Python‏‎ (4 revisions)
127. Lithography Calibration - Analyzing a Focus-Exposure Matrix‏‎ (4 revisions)
128. GCA 6300 Reboot Procedures‏‎ (4 revisions)
129. Critical Point Dryer‏‎ (4 revisions)
130. Spin Rinse Dryer (SemiTool)‏‎ (5 revisions)
131. Lift-Off with I-Line Imaging Resist + LOL2000 Underlayer‏‎ (5 revisions)
132. Old Deposition Data - 2021-12-15‏‎ (5 revisions)
133. Mechanical Polisher (Allied)‏‎ (5 revisions)
134. Sputter 2 (SFI Endeavor)‏‎ (5 revisions)
135. Goniometer (Rame-Hart A-100) - Operating Procedure‏‎ (5 revisions)
136. Thermal Evaporator 1‏‎ (5 revisions)
137. Vraj Mehalana‏‎ (5 revisions)
138. PubList2018‏‎ (5 revisions)
139. Processing - How Do I…?‏‎ (5 revisions)
140. Tino Sy‏‎ (5 revisions)
141. Old Training Manual‏‎ (5 revisions)
142. Digital Microscope (Olympus DSX1000)‏‎ (6 revisions)
143. Olympus LEXT OLS4000 Confocal uScope - Quick Start‏‎ (6 revisions)
144. MLA150 - CAD Files and Templates‏‎ (6 revisions)
145. Tube Furnace Wafer Bonding (Thermco)‏‎ (6 revisions)
146. E-BEAM‏‎ (6 revisions)
147. Photonics Presentations‏‎ (6 revisions)
148. Edge Bead Removal via Photolithography for 4-inch Wafers‏‎ (6 revisions)
149. Optical Film Thickness (Filmetrics)‏‎ (6 revisions)
150. Wafer Cleaver (PELCO Flip-Scribe)‏‎ (6 revisions)
151. Wafer Scanning/Coating Process Traveler ( combined/less detailed)‏‎ (7 revisions)
152. Programming a Job‏‎ (7 revisions)
153. NanoFab Process Group‏‎ (7 revisions)
154. Dan Read‏‎ (7 revisions)
155. Flip-Chip Bonder (Finetech)‏‎ (7 revisions)
156. PECV1 Wafer Coating Process Traveler‏‎ (7 revisions)
157. Autostep 200 User Accessible Commands‏‎ (7 revisions)
158. RIE 1 (Custom)‏‎ (7 revisions)
159. Ovens 1, 2 & 3 (Labline)‏‎ (7 revisions)
160. PECVD1-(PlasmaTherm 790)‏‎ (7 revisions)
161. GCA Old full training manual‏‎ (7 revisions)
162. Deposition Data - temporary 2021-12-15‏‎ (7 revisions)
163. Automated Wafer Cleaver (Loomis LSD-155LT)‏‎ (7 revisions)
164. S-Cubed Flexi - Operating Procedure‏‎ (7 revisions)
165. Bill Millerski‏‎ (7 revisions)
166. ADT 7100 - Initial Setup Before Cutting‏‎ (7 revisions)
167. Tutorials‏‎ (7 revisions)
168. Luis Zuzunaga‏‎ (7 revisions)
169. High Temp Oven (Blue M)‏‎ (7 revisions)
170. Optical Film Spectra + Optical Properties (Filmetrics F10-RT-UVX)‏‎ (8 revisions)
171. Stocked Chemical List‏‎ (8 revisions)
172. Mask Making Guidelines for Contact Aligners‏‎ (8 revisions)
173. Resistivity Mapper (CDE RESMAP)‏‎ (8 revisions)
174. FIJI - Microscope Measurement Tools‏‎ (8 revisions)
175. Probe Station: I-V Curves with Keithley 2400 and Python Script‏‎ (8 revisions)
176. Filmetrics F40-UV Quick Start‏‎ (8 revisions)
177. ASML 5500: Recovering from an Error‏‎ (8 revisions)
178. Bill Mitchell‏‎ (9 revisions)
179. Optical Film Thickness & Wafer-Mapping (Filmetrics F50)‏‎ (9 revisions)
180. Ashers (Technics PEII)‏‎ (9 revisions)
181. YES-150C-Various-Resists‏‎ (9 revisions)
182. KLA Tencor P7 - Saving Profile Data‏‎ (9 revisions)
183. Nano-Imprint (Nanonex NX2000)‏‎ (9 revisions)
184. Focused Ion-Beam Lithography (Raith Velion)‏‎ (9 revisions)
185. GCA 6300 Mask Making Guidance‏‎ (9 revisions)
186. Fluorescence Microscope (Olympus MX51)‏‎ (9 revisions)
187. Old Deposition Data - NastaziaM 2021-11-22‏‎ (9 revisions)
188. Oven 4 (Thermo-Fisher HeraTherm)‏‎ (9 revisions)
189. Optical Film Thickness (Nanometric)‏‎ (9 revisions)
190. Ning Cao‏‎ (10 revisions)
191. Adam Abrahamsen‏‎ (10 revisions)
192. Wafer Coating Process Traveler1‏‎ (10 revisions)
193. SEM Sample Coater (Hummer)‏‎ (10 revisions)
194. InP Etch Test Result in Details‏‎ (10 revisions)
195. Intellemetrics Laser Etch Monitor Procedure for Panasonic ICP Etchers‏‎ (10 revisions)
196. CC-PRIME OnBoarding 2022-08‏‎ (10 revisions)
197. IBD: Calibrating Optical Thickness‏‎ (10 revisions)
198. Process Group Interns‏‎ (10 revisions)
199. Measurements and Imaging with Amscope Camera - Quickstart Usage Guide‏‎ (10 revisions)
200. GCA 6300 USer Accessible Commands‏‎ (10 revisions)
201. Process Group - Billing Instructions‏‎ (10 revisions)
202. Photoluminescence PL Setup (Custom)‏‎ (10 revisions)
203. Homepage Draft1‏‎ (11 revisions)
204. Photolithography - Manual Edge-Bead Removal Techniques‏‎ (11 revisions)
205. Deep UV Optical Microscope (Olympus)‏‎ (11 revisions)
206. IR Aligner (SUSS MJB-3 IR)‏‎ (11 revisions)
207. Logitech WBS7 - Procedure for Wax Mounting with bulk Crystalbond Stick‏‎ (11 revisions)
208. Step Profilometer (KLA Tencor P-7)‏‎ (11 revisions)
209. Noah Dutra‏‎ (11 revisions)
210. ASML Stepper 3 - Job Creator‏‎ (11 revisions)
211. Unaxis wafer coating procedure‏‎ (12 revisions)
212. YES-SPR220-Various-Temps‏‎ (12 revisions)
213. Process Group - Remote Fabrication Jobs‏‎ (12 revisions)
214. Molecular Vapor Deposition‏‎ (12 revisions)
215. Ovens - Overview of All Lab Ovens‏‎ (12 revisions)
216. Wafer Bonder (SUSS SB6-8E)‏‎ (12 revisions)
217. Film Stress (Tencor Flexus)‏‎ (12 revisions)
218. UV Ozone Reactor‏‎ (12 revisions)
219. Chemical-Mechanical Polisher (Logitech)‏‎ (12 revisions)
220. Holographic Lith/PL Setup (Custom)‏‎ (12 revisions)
221. Stepper Reticle Layout (Advanced) - Complex Experiments and Variations‏‎ (12 revisions)
222. Brian Thibeault‏‎ (12 revisions)
223. Chemical List‏‎ (12 revisions)
224. InP etch result in details‏‎ (13 revisions)
225. Field Emission SEM 2 (JEOL IT800SHL)‏‎ (13 revisions)
226. KLayout Design Tips‏‎ (14 revisions)
227. Lee Sawyer‏‎ (14 revisions)
228. Step Profilometer (DektakXT)‏‎ (14 revisions)
229. Unaxis VLR Etch - Process Control Data‏‎ (15 revisions)
230. Test Data of etching SiO2 with CHF3/CF4/O2 (using this recipe only for Fluorine etch of the underneath layer)‏‎ (16 revisions)
231. PECVD1 Wafer Coating Process Traveler‏‎ (16 revisions)
232. Nanofab Job Postings‏‎ (16 revisions)
233. SEM 1 (JEOL IT800SHL)‏‎ (16 revisions)
234. ASML Stepper 3 Standard Operating Procedure‏‎ (16 revisions)
235. Laser Etch Monitoring‏‎ (17 revisions)
236. DUV Flood Expose‏‎ (17 revisions)
237. XeF2 Etch (Xetch)‏‎ (17 revisions)
238. Atomic Force Microscope (Bruker ICON)‏‎ (18 revisions)
239. Wafer Bonder (Logitech WBS7)‏‎ (18 revisions)
240. Sputter 5 (AJA ATC 2200-V)‏‎ (18 revisions)
241. Troubleshooting and Recovery‏‎ (19 revisions)
242. Probe Station & Curve Tracer‏‎ (19 revisions)
243. Laser Scanning Confocal M-scope (Olympus LEXT)‏‎ (19 revisions)
244. ASML Stepper 3 - UCSB Test Reticles‏‎ (19 revisions)
245. Oven 5 (Labline)‏‎ (19 revisions)
246. Tech Talks Seminar Series‏‎ (19 revisions)
247. Filmetrics F40-UV Microscope-Mounted‏‎ (19 revisions)
248. E-Beam Lithography System (JEOL JBX-6300FS)‏‎ (19 revisions)
249. Sputter 4 (AJA ATC 2200-V)‏‎ (20 revisions)
250. Automated Coat/Develop System (S-Cubed Flexi)‏‎ (20 revisions)